Inventor · disambiguated record
John Jianhong Zhu
Also filed as: ZHU JOHN · ZHU JOHN J · ZHU JOHN JIANHONG
46 granted patents·38 pending applications·193 citations·filing 2012–2024
97Inventor score
Top patents by PatentIndex Score
84 records- 0197US9793164B2Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devicesQUALCOMM INC·Filed 2015·Granted Oct 17, 2017·23 cites·19 claims
- 0296US9871121B2Semiconductor device having a gap defined thereinQUALCOMM INC·Filed 2014·Granted Jan 16, 2018·25 cites·16 claims
- 0395US9799560B2Self-aligned structureQUALCOMM INC·Filed 2015·Granted Oct 24, 2017·13 cites·40 claims
- 0494US10354912B2Forming self-aligned vertical interconnect accesses (VIAs) in interconnect structures for integrated circuits (ICs)QUALCOMM INC·Filed 2016·Granted Jul 16, 2019·12 cites·14 claims
- 0593US9543248B2Integrated circuit devices and methodsQUALCOMM INC·Filed 2015·Granted Jan 10, 2017·8 cites·20 claims
- 0692US9953979B2Contact wrap around structureQUALCOMM INC·Filed 2015·Granted Apr 24, 2018·8 cites·14 claims
- 0791US9633996B1High density area efficient thin-oxide decoupling capacitor using conductive gate resistorQUALCOMM INC·Filed 2016·Granted Apr 25, 2017·8 cites·25 claims
- 0891US9379058B2Grounding dummy gate in scaled layout designQUALCOMM INC·Filed 2014·Granted Jun 28, 2016·13 cites·15 claims
- 0991US9343357B2Selective conductive barrier layer formationQUALCOMM INC·Filed 2014·Granted May 17, 2016·10 cites·16 claims
- 1089US10483200B1Integrated circuits (ICs) employing additional output vertical interconnect access(es) (VIA(s)) coupled to a circuit output VIA to decrease circuit output resistanceQUALCOMM INC·Filed 2018·Granted Nov 19, 2019·5 cites·24 claims
- 1188US9721891B2Integrated circuit devices and methodsQUALCOMM INC·Filed 2016·Granted Aug 1, 2017·3 cites·20 claims
- 1287US8980708B2Complementary back end of line (BEOL) capacitorQUALCOMM INC·Filed 2013·Granted Mar 17, 2015·8 cites·8 claims
- 1385US10283526B2Standard cell circuits employing voltage rails electrically coupled to metal shunts for reducing or avoiding increases in voltage dropQUALCOMM INC·Filed 2016·Granted May 7, 2019·5 cites·26 claims
- 1484US10043796B2Vertically stacked nanowire field effect transistorsQUALCOMM INC·Filed 2016·Granted Aug 7, 2018·4 cites·33 claims
- 1584US9941154B2Reverse self aligned double patterning process for back end of line fabrication of a semiconductor deviceQUALCOMM INC·Filed 2016·Granted Apr 10, 2018·3 cites·15 claims
- 1681US9653399B2Middle-of-line integration methods and semiconductor devicesQUALCOMM INC·Filed 2015·Granted May 16, 2017·3 cites·11 claims
- 1781US9269492B2Bone frame, low resistance via coupled metal oxide-metal (MOM) orthogonal finger capacitorQUALCOMM INC·Filed 2013·Granted Feb 23, 2016·6 cites·22 claims
- 1880US11239307B2Metal-oxide-metal capacitor from subtractive back-end-of-line schemeQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·1 cites·20 claims
- 1980US9502424B2Integrated circuit device featuring an antifuse and method of making sameQUALCOMM INC·Filed 2012·Granted Nov 22, 2016·5 cites·43 claims
- 2080US9252104B2Complementary back end of line (BEOL) capacitorQUALCOMM INC·Filed 2014·Granted Feb 2, 2016·4 cites·12 claims
- 2180US9024418B2Local interconnect structures for high densityQUALCOMM INC·Filed 2013·Granted May 5, 2015·5 cites·20 claims
- 2279US11404373B2Hybrid low resistance metal linesQUALCOMM INC·Filed 2019·Granted Aug 2, 2022·2 cites·30 claims
- 2379US10497702B2Metal-oxide semiconductor (MOS) standard cells employing electrically coupled source regions and supply rails to relax source-drain tip-to-tip spacing between adjacent MOS standard cellsQUALCOMM INC·Filed 2017·Granted Dec 3, 2019·3 cites·26 claims
- 2478US10163792B2Semiconductor device having an airgap defined at least partially by a protective structureQUALCOMM INC·Filed 2014·Granted Dec 25, 2018·3 cites·30 claims
- 2574US9564361B2Reverse self aligned double patterning process for back end of line fabrication of a semiconductor deviceQUALCOMM INC·Filed 2013·Granted Feb 7, 2017·2 cites·33 claims
- 2673US2024203866A1INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODSQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2772US10079293B2Semiconductor device having a gap defined thereinQUALCOMM INC·Filed 2017·Granted Sep 18, 2018·1 cites·23 claims
- 2872US9620454B2Middle-of-line (MOL) manufactured integrated circuits (ICs) employing local interconnects of metal lines using an elongated via, and related methodsQUALCOMM INC·Filed 2014·Granted Apr 11, 2017·2 cites·18 claims
- 2970US10636737B2Structure and method of metal wraparound for low via resistanceQUALCOMM INC·Filed 2018·Granted Apr 28, 2020·1 cites·5 claims
- 3068US9842802B2Integrated circuit device featuring an antifuse and method of making sameQUALCOMM INC·Filed 2014·Granted Dec 12, 2017·2 cites·20 claims
- 3166US9818817B2Metal-insulator-metal capacitor over conductive layerQUALCOMM INC·Filed 2013·Granted Nov 14, 2017·2 cites·13 claims
- 3266US9263279B2Combining cut mask lithography and conventional lithography to achieve sub-threshold pattern featuresQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·1 cites·7 claims
- 3364US11942414B2Integrated circuits (ICs) employing directly coupled metal lines between vertically-adjacent interconnect layers for reduced coupling resistance, and related methodsQUALCOMM INC·Filed 2021·Granted Mar 26, 2024·0 cites·15 claims
- 3463US8975724B2Anti-fuse devicePARK YONG·Filed 2012·Granted Mar 10, 2015·2 cites·18 claims
- 3562US2025336811A1High-precision backside resistorQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3662US2025351518A1Double-sided contact in backside power distribution network integration schemeQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3762US2025357326A1Semiconductor die having a metallization layer including a metal layer and a resistive metal in the metal layer to decrease parasitic capacitanceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3861US2025267932A1Recessed through-die vertical interconnect accesses to back-side power distribution networks and related methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3961US2025293146A1Stacked metal-oxide-metal (mom) capacitor(s) in front side and back side metallization layer(s) of semiconductor die, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4061US2025279354A1Die interconnect structure with embedded inductor(s) including coupled coils formed in redistribution layer (rdl) and adjacent bump-level distribution layer (bdl) for improved q factorQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4159US2025096139A1Airgaps in top layers of semiconductor devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4259US2025046716A1Modified reverse selective barrier structureQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4358US2024379770A1Self-aligned contact structures and methods for making the sameQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4457US12068238B2Back-end-of-line (BEOL) high resistance (Hi-R) conductor layer in a metal oxide metal (MOM) capacitorQUALCOMM INC·Filed 2021·Granted Aug 20, 2024·0 cites·26 claims
- 4556US11973020B2Metal-insulator-metal capacitor with top contactQUALCOMM INC·Filed 2021·Granted Apr 30, 2024·0 cites·30 claims
- 4656US11302638B2Hybrid conductor integration in power railQUALCOMM INC·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 4754US12342595B2Transistor cell with self-aligned gate contactQUALCOMM INC·Filed 2021·Granted Jun 24, 2025·0 cites·13 claims
- 4854US2015270134A1Methods of forming a metal-insulator-semiconductor (mis) structure and a dual contact deviceQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4952US2023223341A1Low via resistance interconnect structureQUALCOMM INC·Filed 2022·Application pending·0 cites
- 5051US11038344B2Shunt power rail with short line effectQUALCOMM INC·Filed 2019·Granted Jun 15, 2021·0 cites·17 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →