Inventor · disambiguated record
Tetsuya Katou
Also filed as: KATOU TETSUYA
17 granted patents·8 pending applications·101 citations·filing 1994–2019
92Inventor score
Top patents by PatentIndex Score
25 records- 0189US5683998ATricyclic triazolo derivatives, processes for producing the same and the uses of the sameTORAY INDUSTRIES·Filed 1995·Granted Nov 4, 1997·56 cites·16 claims
- 0284US7853909B2ESD analysis device and ESD analysis program used for designing semiconductor device and method of designing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2007·Granted Dec 14, 2010·12 cites·20 claims
- 0372US8445987B2Semiconductor device having a lower-layer lineKATOU TETSUYA·Filed 2009·Granted May 21, 2013·5 cites·20 claims
- 0472US8230373B2ESD analysis device and ESD analysis program used for designing semiconductor device and method of designing semiconductor deviceKOBAYASHI SUSUMU·Filed 2010·Granted Jul 24, 2012·3 cites·4 claims
- 0566US7960824B2Semiconductor device including power supply pad and trunk wiring which are arranged at the same layer levelRENESAS ELECTRONICS CORP·Filed 2009·Granted Jun 14, 2011·3 cites·16 claims
- 0663US7241816B2Expandable styrene resin particles, expandable beads, and foamed articleHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 10, 2007·4 cites·2 claims
- 0762US8067790B2Semiconductor device with less power supply noiseKATOU TETSUYA·Filed 2008·Granted Nov 29, 2011·2 cites·13 claims
- 0861US8334201B2Semiconductor device and inspection method thereforKATOU TETSUYA·Filed 2011·Granted Dec 18, 2012·1 cites·7 claims
- 0958US8198751B2Semiconductor device and control method of switch transistor thereofKATOU TETSUYA·Filed 2009·Granted Jun 12, 2012·2 cites·3 claims
- 1057US2007082960A1Expandable styrene resin particles, expandable beads, and foamed articleKUNIMI MAKOTO·Filed 2006·Application pending·0 cites
- 1157US2007093563A1Expandable styrene resin particles, expandable beads, and foamed articleKUNIMI MAKOTO·Filed 2006·Application pending·0 cites
- 1256US6797733B2Expandable styrene resin particles, expandable beads, and foamed articleHITACHI CHEMICAL CO LTD·Filed 2003·Granted Sep 28, 2004·2 cites·40 claims
- 1354US7027674B2Optical module and optical transmission apparatusOPNEXT JAPAN INC·Filed 2003·Granted Apr 11, 2006·4 cites·17 claims
- 1453US11407167B2Three-dimensional object manufacturing method and three-dimensional object manufacturing systemMIMAKI ENG CO LTD·Filed 2019·Granted Aug 9, 2022·0 cites·13 claims
- 1551US8264090B2Semiconductor device including offset bonding pad and inspection method thereforKATOU TETSUYA·Filed 2009·Granted Sep 11, 2012·0 cites·5 claims
- 1650US5808106AMethod for producing 2-(ω-alkoxycarbonyl alkanoyl)-4-butanolide and a long-chain ω-hydroxycarboxylic acidFiled 1995·Granted Sep 15, 1998·4 cites·10 claims
- 1750US2010029526A1Urea grease compositionTANAKA KEIJI·Filed 2007·Application pending·0 cites
- 1848US11040488B2Building apparatus and building methodMIMAKI ENG CO LTD·Filed 2018·Granted Jun 22, 2021·0 cites·13 claims
- 1945US2012037959A1Semiconductor device with less power supply noiseKATOU TETSUYA·Filed 2011·Application pending·0 cites
- 2044US2006154833A1Lubricating grease compositionKATOU TETSUYA·Filed 2005·Application pending·0 cites
- 2142US2005187307A1Expandable styrene resin particles, expandable beads, and foamed articleFiled 2004·Application pending·0 cites
- 2242US2019016056A1Shaping device, shaping methodMIMAKI ENG CO LTD·Filed 2018·Application pending·0 cites
- 2340US2006117283A1Integrated circuit verification method, verification apparatus, and verification programNEC ELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 2438US6222049B12-(ω-alkoxycarbonyl alkanoyl)-4-butanolideTORAY INDUSTRIES·Filed 1998·Granted Apr 24, 2001·1 cites·6 claims
- 2533US5478823AComposition for suppressing infiltration of eosinophilsTORAY INDUSTRIES·Filed 1994·Granted Dec 26, 1995·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →