Inventor · disambiguated record
Toshiya Kinoshita
Also filed as: KINOSHITA TOSHIYA
9 granted patents·3 pending applications·234 citations·filing 1986–2015
89Inventor score
Files withNIPPON STEEL CORP5KINOSHITA TOSHIYA1NIPPON STEEL CHEMICAL & MAT CO LTD1NIPPON STEEL MATERIALS CO LTD1SAKAMOTO HIROAKI1
Top patents by PatentIndex Score
12 records- 0194US7465217B2CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditionerNIPPON STEEL CORP·Filed 2006·Granted Dec 16, 2008·36 cites·5 claims
- 0287US6190240B1Method for producing pad conditioner for semiconductor substratesNIPPON STEEL CORP·Filed 1997·Granted Feb 20, 2001·94 cites·12 claims
- 0382US9102038B2Beveling grindstoneKINOSHITA TOSHIYA·Filed 2011·Granted Aug 11, 2015·7 cites·4 claims
- 0475US4765739AFiber optical rotation sensor utilizing the Sagnac phase differenceTOSHIBA KK·Filed 1986·Granted Aug 23, 1988·41 cites·5 claims
- 0573US6752708B1Pad conditioner for semiconductor substratesNIPPON STEEL CORP·Filed 2000·Granted Jun 22, 2004·16 cites·8 claims
- 0672US8096858B2Polishing pad conditionerSAKAMOTO HIROAKI·Filed 2006·Granted Jan 17, 2012·6 cites·4 claims
- 0762US6309433B1Polishing pad conditioner for semiconductor substrateNIPPON STEEL CORP·Filed 1999·Granted Oct 30, 2001·23 cites·5 claims
- 0854US5407750AHigh purity dense silicon carbide sintered body and process for making sameNIPPON STEEL CORP·Filed 1992·Granted Apr 18, 1995·11 cites·10 claims
- 0954US2002040347A1Digital contents data generating systemFiled 2001·Application pending·0 cites
- 1051US2010291844A1Dresser for abrasive clothNIPPON STEEL MATERIALS CO LTD·Filed 2008·Application pending·0 cites
- 1145US10596678B2Sheet glass toolNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2015·Granted Mar 24, 2020·0 cites·10 claims
- 1237US2004072510A1Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditionerFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →