Inventor · disambiguated record
John Sukamto
Also filed as: SUKAMTO JOHN · SUKAMTO JOHN H
7 granted patents·233 citations·filing 2003–2012
88Inventor score
Top patents by PatentIndex Score
7 records- 0196US8128791B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2006·Granted Mar 6, 2012·39 cites·24 claims
- 0295US8513124B1Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafersPONNUSWAMY THOMAS A·Filed 2010·Granted Aug 20, 2013·30 cites·22 claims
- 0395US7964506B1Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafersNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 21, 2011·60 cites·29 claims
- 0494US9045841B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2012·Granted Jun 2, 2015·9 cites·19 claims
- 0594US7232513B1Electroplating bath containing wetting agent for defect reductionNOVELLUS SYSTEMS INC·Filed 2004·Granted Jun 19, 2007·51 cites·16 claims
- 0693US8703615B1Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafersPONNUSWAMY THOMAS A·Filed 2012·Granted Apr 22, 2014·21 cites·24 claims
- 0777US6884335B2Electroplating using DC current interruption and variable rotation rateNOVELLUS SYSTEMS INC·Filed 2003·Granted Apr 26, 2005·23 cites·57 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →