Inventor · disambiguated record
Ranjan Rajoo
Also filed as: RAJOO RANJAN · RAJOO RANJAN S · RAJOO RANJAN S O
12 granted patents·5 pending applications·67 citations·filing 2003–2024
88Inventor score
Files withGLOBALFOUNDRIES SG PTE LTD9AGENCY SCIENCE TECH & RES3GEORGIA TECH RES INST3GLOBAL FOUNDRIES SINGAPORE PTE LTD1SELVANAYAGAM CHERYL SHARMANI1
Top patents by PatentIndex Score
17 records- 0189US9768089B2Wafer stack protection sealGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Sep 19, 2017·8 cites·20 claims
- 0285US9761561B2Edge structure for backgrinding asymmetrical bonded waferGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Sep 12, 2017·5 cites·20 claims
- 0383US7500378B2Micro-impact testing apparatusAGENCY SCIENCE TECH & RES·Filed 2006·Granted Mar 10, 2009·13 cites·19 claims
- 0481US11444045B2Bonding structures of semiconductor devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 0576US12341111B2Crackstop structuresGLOBALFOUNDRIES SG PTE LTD·Filed 2023·Granted Jun 24, 2025·0 cites·18 claims
- 0673US6890795B1Wafer level super stretch solderGEORGIA TECH RES INST·Filed 2003·Granted May 10, 2005·28 cites·31 claims
- 0770US11244915B2Bond pads of semiconductor devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2019·Granted Feb 8, 2022·1 cites·18 claims
- 0868US9406577B2Wafer stack protection sealGLOBAL FOUNDRIES SINGAPORE PTE LTD·Filed 2014·Granted Aug 2, 2016·3 cites·20 claims
- 0966US11652069B2Crackstop structuresGLOBALFOUNDRIES SG PTE LTD·Filed 2020·Granted May 16, 2023·0 cites·15 claims
- 1064US7464606B2Bend testing apparatus and method of carrying out the sameAGENCY SCIENCE TECH & RES·Filed 2006·Granted Dec 16, 2008·3 cites·35 claims
- 1158US11658128B2Shielding elements for packages of semiconductor devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2021·Granted May 23, 2023·0 cites·17 claims
- 1254US2025343172A1Structure with ic die with enlarged area in scribe regionGLOBALFOUNDRIES SG PTE LTD·Filed 2024·Application pending·0 cites
- 1354US2024178165A1Structure with copper bond pad and copper interconnectGLOBALFOUNDRIES SG PTE LTD·Filed 2022·Application pending·0 cites
- 1451US7178711B2Method and device to elongate a solder jointGEORGIA TECH RES INST·Filed 2003·Granted Feb 20, 2007·5 cites·12 claims
- 1545US2007114266A1Method and device to elongate a solder jointGEORGIA TECH RES INST·Filed 2007·Application pending·0 cites
- 1642US2009091025A1Method for forming and releasing interconnectsAGENCY SCIENCE TECH & RES·Filed 2007·Application pending·0 cites
- 1721US2013328209A1Stack ArrangementSELVANAYAGAM CHERYL SHARMANI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →