Inventor · disambiguated record
Eiji Takai
Also filed as: TAKAI EIJI
6 granted patents·2 pending applications·34 citations·filing 2000–2011
80Inventor score
Top patents by PatentIndex Score
8 records- 0180US6805915B2Electroless copper plating solution, electroless copper plating process and production process of circuit boardHITACHI LTD·Filed 2002·Granted Oct 19, 2004·15 cites·8 claims
- 0267US6831009B2Wiring substrate and an electroless copper plating solution for providing interlayer connectionsHITACHI LTD·Filed 2001·Granted Dec 14, 2004·7 cites·4 claims
- 0364US6900394B1Electroless copper plating machine, and multi-layer printed wiring boardHITACHI LTD·Filed 2000·Granted May 31, 2005·5 cites·4 claims
- 0463US7169216B2Electroless copper plating solution, electroless copper plating process and production process of circuit boardHITACHI LTD·Filed 2004·Granted Jan 30, 2007·4 cites·3 claims
- 0561US2007079727A1Electroless copper plating solution, electroless copper plating process and production process of circuit boardITABASHI TAKEYUKI·Filed 2006·Application pending·0 cites
- 0655US2005252684A1Electroless copper plating machine thereof, and multi-layer printed wiring boardITABASHI TAKEYIKI·Filed 2005·Application pending·0 cites
- 0752US6989329B2Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connectionsHITACHI LTD·Filed 2004·Granted Jan 24, 2006·3 cites·2 claims
- 0832US9075032B2Transport apparatus, transport method, transport program, and transport systemTAKAI EIJI·Filed 2011·Granted Jul 7, 2015·0 cites·22 claims
Join the waitlist — get patent alerts
Get an alert when Eiji Takai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →