Inventor · disambiguated record
Naoki Minorikawa
Also filed as: MINORIKAWA NAOKI
10 granted patents·11 pending applications·100 citations·filing 1989–2025
87Inventor score
Files withSHOWA DENKO KK13RESONAC CORP5JAPAN POLYOLEFINS CO LTD1MINORIKAWA NAOKI1SUMITOMO SEIKA CHEMICALS1
Top patents by PatentIndex Score
21 records- 0192US5183917A4,4'-bis(methacryloylthio)diphenylsulfideSHOWA DENKO KK·Filed 1989·Granted Feb 2, 1993·37 cites·1 claims
- 0289US5270439AMethod of producing a curable composition containing 4,4'-bis(methacryloylthio)diphenylsulfideSUMITOMO SEIKA CHEMICALS·Filed 1992·Granted Dec 14, 1993·37 cites·4 claims
- 0386US2025026934A1Silicon-containing oxide-coated aluminum nitride particle and method of manufacturing the sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 0481US12139618B2Silicon-containing oxide-coated aluminum nitride particle and method of manufacturing the sameSHOWA DENKO KK·Filed 2022·Granted Nov 12, 2024·0 cites·4 claims
- 0575US11396602B2Silicon-containing oxide-coated aluminum nitride particle and method of manufacturing the sameSHOWA DENKO KK·Filed 2019·Granted Jul 26, 2022·0 cites·7 claims
- 0669US2025179269A1Inorganic particle dispersion resin composition and manufacturing method of inorganic particle dispersion resin compositionRESONAC CORP·Filed 2025·Application pending·0 cites
- 0766US12252600B2Inorganic particle dispersion resin composition and manufacturing method of inorganic particle dispersion resin compositionSHOWA DENKO KK·Filed 2020·Granted Mar 18, 2025·0 cites·5 claims
- 0864US6482530B2Extrusion laminate with polyolefin-polyepoxide adhesiveSHOWA DENKO KK·Filed 2001·Granted Nov 19, 2002·4 cites·7 claims
- 0963US6099685AExtrusion laminating substrate with adhesive of olefin polymer and polyepoxideSHOWA DENKO KK·Filed 1997·Granted Aug 8, 2000·15 cites·9 claims
- 1062US2024327646A1Method for producing silicon-containing oxide-coated aluminum nitride particleRESONAC CORP·Filed 2023·Application pending·0 cites
- 1158US7354655B2Adhesive resin composition and multi-layer laminated structure using the sameJAPAN POLYOLEFINS CO LTD·Filed 2002·Granted Apr 8, 2008·2 cites·32 claims
- 1251US2022195141A1Method for producing silica-coated boron nitride particles and silica-coated boron nitride particlesSHOWA DENKO KK·Filed 2020·Application pending·0 cites
- 1350US2024059901A1Method for producing surface-treated thermally conductive filler, and thermally conductive compositionRESONAC CORP·Filed 2021·Application pending·0 cites
- 1449US2024052224A1Thermally conductive compositionRESONAC CORP·Filed 2022·Application pending·0 cites
- 1545US12371570B2Method for producing silicon-containing oxide-coated aluminum nitride particles and method for producing exoergic resin compositionSHOWA DENKO KK·Filed 2020·Granted Jul 29, 2025·0 cites·11 claims
- 1642US2023227707A1Thermally conductive composition and cured product thereofSHOWA DENKO KK·Filed 2021·Application pending·0 cites
- 1742US2024052223A1Thermally conductive urethane resin composition and cured productSHOWA DENKO KK·Filed 2022·Application pending·0 cites
- 1841US2002102408A1Adhesive resin composition and laminate thereof and production process of laminateSHOWA DENKO KK·Filed 2002·Application pending·0 cites
- 1940US6201066B1Adhesive of polyolefin and polyepoxide for extrusion laminationSHOWA DENKO KK·Filed 1997·Granted Mar 13, 2001·5 cites·9 claims
- 2040US2018179383A1Thermosetting silicone resin composition containing boron nitride, dispersant for silicone resin compositions, and inorganic fillerSHOWA DENKO KK·Filed 2016·Application pending·0 cites
- 2128US2012238678A1Chloroprene polymer latex composition and use thereofMINORIKAWA NAOKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →