Inventor · disambiguated record
Masahiko Harayama
Also filed as: HARAYAMA MASAHIKO
7 granted patents·1 pending application·640 citations·filing 2000–2011
86Inventor score
Top patents by PatentIndex Score
8 records- 0197US6316838B1Semiconductor deviceFUJITSU LTD·Filed 2000·Granted Nov 13, 2001·571 cites·8 claims
- 0291US9418940B2Structures and methods for stack type semiconductor packagingHOSHINO MASATAKA·Filed 2008·Granted Aug 16, 2016·35 cites·20 claims
- 0384US8097961B2Semiconductor device having a simplified stack and method for manufacturing thereofTANAKA JUNJI·Filed 2008·Granted Jan 17, 2012·12 cites·15 claims
- 0482US8039943B2Semiconductor device and manufacturing method thereforSPANSION LLC·Filed 2008·Granted Oct 18, 2011·11 cites·4 claims
- 0580US7846829B2Stacked solder balls for integrated circuit device packaging and assemblySPANSION LLC·Filed 2008·Granted Dec 7, 2010·8 cites·10 claims
- 0667US8481366B2Semiconductor device and manufacturing method thereforHARAYAMA MASAHIKO·Filed 2011·Granted Jul 9, 2013·3 cites·14 claims
- 0750US8361857B2Semiconductor device having a simplified stack and method for manufacturing thereofSPANSION LLC·Filed 2011·Granted Jan 29, 2013·0 cites·5 claims
- 0844US2009115070A1Semiconductor device and method for manufacturing thereofTANAKA JUNJI·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →