Inventor · disambiguated record
Robert T. Trabucco
Also filed as: TRABUCCO ROBERT · TRABUCCO ROBERT T
10 granted patents·695 citations·filing 1993–1997
93Inventor score
Technology areasH10W
Files withLSI LOGIC CORP10
Top patents by PatentIndex Score
10 records- 0194US5435482AIntegrated circuit having a coplanar solder ball contact arrayLSI LOGIC CORP·Filed 1994·Granted Jul 25, 1995·145 cites·10 claims
- 0287US5610442ASemiconductor device package fabrication method and apparatusLSI LOGIC CORP·Filed 1995·Granted Mar 11, 1997·100 cites·26 claims
- 0385US5745986AMethod of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpageLSI LOGIC CORP·Filed 1995·Granted May 5, 1998·65 cites·10 claims
- 0485US5388327AFabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device packageLSI LOGIC CORP·Filed 1993·Granted Feb 14, 1995·85 cites·12 claims
- 0584US5465470AFixture for attaching multiple lids to multi-chip module (MCM) integrated circuitLSI LOGIC CORP·Filed 1994·Granted Nov 14, 1995·83 cites·22 claims
- 0683US5381848ACasting of raised bump contacts on a substrateLSI LOGIC CORP·Filed 1993·Granted Jan 17, 1995·76 cites·20 claims
- 0778US5989937AMethod for compensating for bottom warpage of a BGA integrated circuitLSI LOGIC CORP·Filed 1997·Granted Nov 23, 1999·42 cites·9 claims
- 0872US6088914AMethod for planarizing an array of solder ballsLSI LOGIC CORP·Filed 1997·Granted Jul 18, 2000·30 cites·56 claims
- 0968US5899737AFluxless solder ball attachment processLSI LOGIC CORP·Filed 1996·Granted May 4, 1999·38 cites·14 claims
- 1064US5761048AConductive polymer ball attachment for grid array semiconductor packagesLSI LOGIC CORP·Filed 1996·Granted Jun 2, 1998·31 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →