Inventor · disambiguated record
Shu-Chia Hsu
Also filed as: HSU SHU-CHIA
14 granted patents·3 pending applications·31 citations·filing 2005–2025
89Inventor score
Top patents by PatentIndex Score
17 records- 0197US12237288B2Semiconductor die package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·6 cites·20 claims
- 0296US11990443B2Semiconductor die package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·4 cites·20 claims
- 0395US11694939B2Semiconductor package, integrated optical communication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 4, 2023·4 cites·20 claims
- 0494US11764123B2Semiconductor package, integrated optical communication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·2 cites·20 claims
- 0592US10629545B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·6 cites·20 claims
- 0690US10790254B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·6 cites·20 claims
- 0789US10985125B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·2 cites·20 claims
- 0884US2025062250A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0980US12165990B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1077US12315786B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 1177US2025273550A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1269US11587886B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 1368US12327781B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 1468US10867951B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 1549US10872871B2Chip package structure with dummy bump and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 1648US10340242B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 2, 2019·0 cites·20 claims
- 1737US2007096171A1Semiconductor laser device that has the effect of phonon-assisted light amplification and method for manufacturing the sameLIN CHING-FUH·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →