Inventor · disambiguated record
Daisuke Kanamori
Also filed as: KANAMORI DAISUKE
6 granted patents·4 pending applications·0 citations·filing 2014–2023
63Inventor score
Top patents by PatentIndex Score
10 records- 0151US11462973B2Encoder and motorMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 4, 2022·0 cites·10 claims
- 0246US11609106B2Reflective optical encoder comprising a hub with an adhesive surface with a step structureMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Mar 21, 2023·0 cites·18 claims
- 0342US11221231B2EncoderMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 11, 2022·0 cites·16 claims
- 0442US2022155684A1Photosensitive resin composition, photosensitive resin sheet, method for producing hollow structure, and electronic componentTORAY INDUSTRIES·Filed 2020·Application pending·0 cites
- 0542US2025197634A1Photosensitive resin composition, photosensitive resin composition film, cured product, and electronic component using sameTORAY INDUSTRIES·Filed 2023·Application pending·0 cites
- 0640US10294395B2Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using sameTORAY INDUSTRIES·Filed 2015·Granted May 21, 2019·0 cites·6 claims
- 0740US10050005B2Semiconductor resin composition, semiconductor resin film, and semiconductor device using the sameTORAY INDUSTRIES·Filed 2014·Granted Aug 14, 2018·0 cites·14 claims
- 0839US2021091609A1Stator of rotating electrical machine and stator manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 0931US9617451B2Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing sameTORAY INDUSTRIES·Filed 2015·Granted Apr 11, 2017·0 cites·10 claims
- 1028US2020019060A1Photosensitive resin composition, photosensitive resin composition film, insulating film, and electronic componentTORAY INDUSTRIES·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →