Inventor · disambiguated record
Oliver Kierse
Also filed as: KIERSE OLIVER · KIERSE OLIVER J
22 granted patents·2 pending applications·385 citations·filing 1994–2023
95Inventor score
Files withANALOG DEVICES INC13ANALOG DEVICES GLOBAL3ANALOG DEVICES INTERNATIONAL UNLIMITED CO2KIERSE OLIVER2ALBERGHINI JOHN1
Top patents by PatentIndex Score
24 records- 0193US11616027B2Integrated circuit packages to minimize stress on a semiconductor dieANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2020·Granted Mar 28, 2023·3 cites·20 claims
- 0290US9661408B2Packages and methods for packagingANALOG DEVICES INC·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 0390US5486720AEMF shielding of an integrated circuit packageANALOG DEVICES INC·Filed 1994·Granted Jan 23, 1996·123 cites·25 claims
- 0488US10730743B2Gas sensor packagesANALOG DEVICES GLOBAL UNLIMITED CO·Filed 2018·Granted Aug 4, 2020·9 cites·20 claims
- 0588US7939916B2Wafer level CSP packaging conceptANALOG DEVICES INC·Filed 2007·Granted May 10, 2011·19 cites·8 claims
- 0687US9156680B2Packages and methods for packagingANALOG DEVICES INC·Filed 2012·Granted Oct 13, 2015·8 cites·40 claims
- 0784US7938014B2Sealed capacitive sensorANALOG DEVICES INC·Filed 2008·Granted May 10, 2011·11 cites·20 claims
- 0884US5541446AIntegrated circuit package with improved heat dissipationANALOG DEVICES INC·Filed 1995·Granted Jul 30, 1996·80 cites·28 claims
- 0979US8890301B2Packaging and methods for packagingKIERSE OLIVER J·Filed 2012·Granted Nov 18, 2014·7 cites·23 claims
- 1077US5796159AThermally efficient integrated circuit packageANALOG DEVICES INC·Filed 1997·Granted Aug 18, 1998·54 cites·20 claims
- 1174US12027472B2Integrated circuit packages to minimize stress on a semiconductor dieANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 1273US7401523B2Capacitive sensor and method of fabricatingANALOG DEVICES INC·Filed 2006·Granted Jul 22, 2008·10 cites·48 claims
- 1372US8766186B2Control aperture for an IR sensorKIERSE OLIVER·Filed 2007·Granted Jul 1, 2014·6 cites·3 claims
- 1469US7880244B2Wafer level CSP sensorANALOG DEVICES INC·Filed 2009·Granted Feb 1, 2011·4 cites·22 claims
- 1567US8476591B2Radiation sensor device and methodKIERSE OLIVER·Filed 2008·Granted Jul 2, 2013·5 cites·10 claims
- 1665US7897920B2Radiation sensor device and methodANALOG DEVICES INC·Filed 2006·Granted Mar 1, 2011·3 cites·28 claims
- 1765US6225683B1Die size-increasing integrated circuit leads and thermally enhanced leadframeANALOG DEVICES INC·Filed 1999·Granted May 1, 2001·33 cites·23 claims
- 1861US9466666B2Localized strain relief for an integrated circuitANALOG DEVICES GLOBAL·Filed 2013·Granted Oct 11, 2016·1 cites·26 claims
- 1961US7667323B2Spaced, bumped component structureANALOG DEVICES INC·Filed 2005·Granted Feb 23, 2010·2 cites·39 claims
- 2050US2017257687A1Packages and methods for packagingANALOG DEVICES INC·Filed 2017·Application pending·0 cites
- 2148US10461151B2Localized strain relief for an integrated circuitANALOG DEVICES GLOBAL·Filed 2016·Granted Oct 29, 2019·0 cites·20 claims
- 2244US2006191351A1Sealed capacitive sensorMEEHAN PETER G·Filed 2006·Application pending·0 cites
- 2341US9786609B2Stress shield for integrated circuit packageANALOG DEVICES GLOBAL·Filed 2013·Granted Oct 10, 2017·0 cites·32 claims
- 2425US8193620B2Integrated circuit package with enlarged die paddleALBERGHINI JOHN·Filed 2010·Granted Jun 5, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →