Inventor · disambiguated record
Sun-Ghil Lee
Also filed as: LEE SUN-GHIL
28 granted patents·10 pending applications·219 citations·filing 2002–2019
96Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18KIM JIN-BUM4HYNIX SEMICONDUCTOR INC2HYUN SUNG-WOO2PARK HEUNG-KYU2
Top patents by PatentIndex Score
38 records- 0194US7323710B2Fin field effect transistors having multi-layer fin patternsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 29, 2008·84 cites·12 claims
- 0292US7842566B2FinFET and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 30, 2010·20 cites·13 claims
- 0391US7998851B2Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Aug 16, 2011·11 cites·20 claims
- 0487US10256237B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 9, 2019·4 cites·9 claims
- 0584US8008698B2Semiconductor memory devices having vertical channel transistors and related methodsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·11 cites·18 claims
- 0681US6664579B2Magnetic random access memory using bipolar junction transistorHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Dec 16, 2003·29 cites·8 claims
- 0780US8772095B2Method of manufacturing semiconductor device using stress memorization techniqueKIM SEOK-HOON·Filed 2012·Granted Jul 8, 2014·5 cites·23 claims
- 0880US7683421B2NAND-type flash memory devices including selection transistors with an anti-punchthrough impurity region and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 23, 2010·9 cites·20 claims
- 0977US7557388B2MOSFET formed on a strained silicon layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 7, 2009·2 cites·10 claims
- 1074US9112055B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 18, 2015·3 cites·15 claims
- 1174US7393700B2Low temperature methods of etching semiconductor substratesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 1, 2008·4 cites·25 claims
- 1272US7956464B2Sputtering target and semiconductor device manufactured using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jun 7, 2011·5 cites·20 claims
- 1370US7871897B2Method of forming shallow trench isolation regions in devices with NMOS and PMOS regionsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 18, 2011·5 cites·20 claims
- 1469US6657270B2Magnetic random access memory using bipolar junction transistor, and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Dec 2, 2003·16 cites·7 claims
- 1568US7799648B2Method of forming a MOSFET on a strained silicon layerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 21, 2010·0 cites·8 claims
- 1665US8853010B2Semiconductor device and method of fabricating the samePARK HEUNG-KYU·Filed 2012·Granted Oct 7, 2014·2 cites·21 claims
- 1764US11011516B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1864US8692372B2Semiconductor device having impurity doped polycrystalline layer including impurity diffusion prevention layer and dynamic random memory device including the semiconductor deviceLEE DONG-KAK·Filed 2010·Granted Apr 8, 2014·2 cites·6 claims
- 1963US8409947B2Method of manufacturing semiconductor device having stress creating layerKIM JIN-BUM·Filed 2010·Granted Apr 2, 2013·1 cites·9 claims
- 2062US8604551B2Semiconductor device including trenches having particular structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 10, 2013·1 cites·4 claims
- 2161US10559565B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 11, 2020·0 cites·18 claims
- 2260US8877583B2Method of manufacturing a semiconductor deviceKIM JIN-BUM·Filed 2012·Granted Nov 4, 2014·1 cites·10 claims
- 2359US8470703B2Semiconductor device and method of fabricating the sameLEE BYUNG-HAK·Filed 2011·Granted Jun 25, 2013·2 cites·16 claims
- 2459US8361860B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 29, 2013·1 cites·15 claims
- 2555US8415224B2Method of fabricating a semiconductor device including forming trenches having particular structuresHYUN SUNG-WOO·Filed 2011·Granted Apr 9, 2013·1 cites·16 claims
- 2655US2010001349A1Semiconductor deviceKIM JIN-BUM·Filed 2009·Application pending·0 cites
- 2751US8716093B2Methods of manufacturing a semiconductor deviceKIM JIN-BUM·Filed 2012·Granted May 6, 2014·0 cites·14 claims
- 2851US8481416B2Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the sameSON YONG-HOON·Filed 2011·Granted Jul 9, 2013·0 cites·20 claims
- 2948US2010055856A1Method of forming oxide layer, and method of manufacturing semiconductor deviceHONG SOO-JIN·Filed 2009·Application pending·0 cites
- 3048US2009130826A1Method of Forming a Semiconductor Device Having a Strained Silicon Layer on a Silicon-Germanium LayerSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3147US2015008452A1Semiconductor device and method of fabricating the samePARK HEUNG-KYU·Filed 2014·Application pending·0 cites
- 3246US2005248035A1Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the sameSON YONG-HOON·Filed 2005·Application pending·0 cites
- 3342US2008048262A1Fin field effect transistor and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3442US2006079056A1Semiconductor structures having a strained silicon layer on a silicon-germanium layer and related fabrication methodsKIM YOUNG-PIL·Filed 2005·Application pending·0 cites
- 3535US2008073730A1Semiconductor device and method for formimg the sameLEE DEOK-HYUNG·Filed 2007·Application pending·0 cites
- 3634US2011266627A1Semiconductor deviceLEE SEUNG-HUN·Filed 2011·Application pending·0 cites
- 3732US2011177671A1Methods of forming a semiconductor cell array region, method of forming a semiconductor device including the semiconductor cell array region, and method of forming a semiconductor module including the semiconductor deviceHYUN SUNG-WOO·Filed 2010·Application pending·0 cites
- 3831US8759182B2Manufacturing method for semiconductor deviceSIM HYUN-JUN·Filed 2012·Granted Jun 24, 2014·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →