Inventor · disambiguated record

Low Peng Wang

Also filed as: WANG LOW PENG

2 granted patents·9 citations·filing 2007–2008

54Inventor score

Technology areasH10W

Files withMICRON TECHNOLOGY INC1 WANG LOW PENG1

Top patents by PatentIndex Score

2 records

0161US7906853B2Package structure for multiple die stackMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 15, 2011·5 cites·13 claims
0258US8444044B2Apparatus and methods for forming wire bondsWANG LOW PENG·Filed 2008·Granted May 21, 2013·4 cites·24 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →