Inventor · disambiguated record
Kanji Ohno
Also filed as: OHNO KANJI
4 granted patents·2 pending applications·74 citations·filing 1999–2004
78Inventor score
Files withEBARA CORP4
Top patents by PatentIndex Score
6 records- 0181US6517894B1Method for plating a first layer on a substrate and a second layer on the first layerEBARA CORP·Filed 1999·Granted Feb 11, 2003·49 cites·125 claims
- 0273US6811658B2Apparatus for forming interconnectsEBARA CORP·Filed 2001·Granted Nov 2, 2004·14 cites·20 claims
- 0364US6242624B1Method for making alkanol-or alkane-sulfone plumbateEBARA CORP·Filed 2000·Granted Jun 5, 2001·4 cites·5 claims
- 0463US6908534B2Substrate plating method and apparatusEBARA CORP·Filed 2001·Granted Jun 21, 2005·7 cites·12 claims
- 0542US2005098439A1Substrate plating method and apparatusFiled 2004·Application pending·0 cites
- 0641US2004200728A1Method and apparatus for forming interconnects, and polishing liquid and polishing methodFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →