Inventor · disambiguated record
Jason J. Payne
Also filed as: PAYNE JASON J
8 granted patents·1,058 citations·filing 2003–2007
92Inventor score
Top patents by PatentIndex Score
8 records- 0199US6872085B1High speed, high density electrical connector assemblyTERADYNE INC·Filed 2003·Granted Mar 29, 2005·260 cites·7 claims
- 0298US7074086B2High speed, high density electrical connectorAMPHENOL CORP·Filed 2003·Granted Jul 11, 2006·155 cites·18 claims
- 0398US6776659B1High speed, high density electrical connectorTERADYNE INC·Filed 2003·Granted Aug 17, 2004·264 cites·16 claims
- 0497US6827611B1Electrical connector with multi-beam contactTERADYNE INC·Filed 2003·Granted Dec 7, 2004·122 cites·6 claims
- 0597US6814619B1High speed, high density electrical connector and connector assemblyTERADYNE INC·Filed 2003·Granted Nov 9, 2004·177 cites·24 claims
- 0691US6780059B1High speed, high density electrical connectorTERADYNE INC·Filed 2003·Granted Aug 24, 2004·53 cites·22 claims
- 0779US7508681B2Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristicsAMPHENOL CORP·Filed 2007·Granted Mar 24, 2009·7 cites·19 claims
- 0875US7242592B2Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristicsAMPHENOL CORP·Filed 2003·Granted Jul 10, 2007·20 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →