Inventor · disambiguated record
Ta-Hung Yang
Also filed as: YANG TA-HUNG
27 granted patents·13 pending applications·120 citations·filing 1994–2023
94Inventor score
Top patents by PatentIndex Score
40 records- 0192US9236219B2Measurement of line-edge-roughness and line-width-roughness on pre-layered structuresMACRONIX INT CO LTD·Filed 2013·Granted Jan 12, 2016·22 cites·21 claims
- 0284US10388664B2Integrated circuit device with layered trench conductorsMACRONIX INT CO LTD·Filed 2018·Granted Aug 20, 2019·5 cites·17 claims
- 0381US9905509B2Inverted-T shaped via for reducing adverse stress-migration effectsMACRONIX INT CO LTD·Filed 2014·Granted Feb 27, 2018·7 cites·14 claims
- 0481US7939451B2Method for fabricating a patternMACRONIX INT CO LTD·Filed 2007·Granted May 10, 2011·8 cites·18 claims
- 0568US5883001AIntegrated circuit passivation process and structureMACRONIX INT CO LTD·Filed 1994·Granted Mar 16, 1999·51 cites·21 claims
- 0666US8034691B2HDP-CVD process, filling-in process utilizing HDP-CVD, and HDP-CVD systemMACRONIX INT CO LTD·Filed 2008·Granted Oct 11, 2011·0 cites·9 claims
- 0760US6875659B2Methods of code programming a mask ROMMACRONIX INT CO LTD·Filed 2003·Granted Apr 5, 2005·7 cites·29 claims
- 0860US2025089258A1Manufacturing method of memory device and manufacturing method of tungsten layerMACRONIX INT CO LTD·Filed 2023·Application pending·0 cites
- 0959US7648921B2Method of forming dielectric layerMACRONIX INT CO LTD·Filed 2006·Granted Jan 19, 2010·3 cites·12 claims
- 1056US7846835B2Contact barrier layer deposition processMACRONIX INT CO LTD·Filed 2007·Granted Dec 7, 2010·0 cites·39 claims
- 1156US6864185B2Fine line printing by trimming the sidewalls of pre-developed resist imageMACRONIX INT CO LTD·Filed 2003·Granted Mar 8, 2005·4 cites·34 claims
- 1255US6799152B1Critical dimension statistical process control in semiconductor fabricationMACRONIX INT CO LTD·Filed 2002·Granted Sep 28, 2004·7 cites·26 claims
- 1353US8519541B2Semiconductor device having plural conductive layers disposed within dielectric layerLUOH TUUNG·Filed 2008·Granted Aug 27, 2013·0 cites·10 claims
- 1453US8520194B2Method of forming a deposited material by utilizing a multi-step deposition/etch/deposition (D/E/D) processLUOH TUUNG·Filed 2008·Granted Aug 27, 2013·0 cites·6 claims
- 1552US8184288B2Method of depositing a silicon-containing material by utilizing a multi-step fill-in process in a deposition machineLUOH TUUNG·Filed 2009·Granted May 22, 2012·0 cites·10 claims
- 1652US8085390B2Multivariate monitoring method for plasma process machineLUOH TUUNG·Filed 2007·Granted Dec 27, 2011·0 cites·9 claims
- 1752US8067292B2Isolation structure, non-volatile memory having the same, and method of fabricating the sameCHENG MING-DA·Filed 2008·Granted Nov 29, 2011·0 cites·22 claims
- 1852US2008132060A1Contact barrier layer deposition processMACRONIX INT CO LTD·Filed 2006·Application pending·0 cites
- 1951US9252153B1Method of word-line formation by semi-damascene process with thin protective conductor layerMACRONIX INT CO LTD·Filed 2014·Granted Feb 2, 2016·0 cites·8 claims
- 2050US10892265B2Word line structure and method of manufacturing the sameMACRONIX INT CO LTD·Filed 2019·Granted Jan 12, 2021·0 cites·19 claims
- 2150US7960835B2Fabrication of metal film stacks having improved bottom critical dimensionMACRONIX INT CO LTD·Filed 2009·Granted Jun 14, 2011·0 cites·20 claims
- 2249US2011056432A1Contact barrier layer deposition processMACRONIX INT CO LTD·Filed 2010·Application pending·0 cites
- 2348US2010244180A1Method for fabricating device isolation structureMACRONIX INT CO LTD·Filed 2009·Application pending·0 cites
- 2447US10497652B1Semiconductor substrate and semiconductor deviceMACRONIX INT CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·17 claims
- 2547US8653592B2Isolation structure, non-volatile memory having the same, and method of fabricating the sameCHENG MING-DA·Filed 2011·Granted Feb 18, 2014·0 cites·24 claims
- 2646US2009081859A1Metallization processMACRONIX INT CO LTD·Filed 2007·Application pending·0 cites
- 2746US2012000423A1Hdp-cvd systemLUOH TUUNG·Filed 2011·Application pending·0 cites
- 2845US7786023B2Metal pad formation method and metal pad structure using the sameMACRONIX INT CO LTD·Filed 2007·Granted Aug 31, 2010·0 cites·21 claims
- 2944US7625819B2Interconnection processMACRONIX INT CO LTD·Filed 2007·Granted Dec 1, 2009·0 cites·10 claims
- 3043US6969642B2Method of controlling implantation dosages during coding of read-only memory devicesMACRONIX INT CO LTD·Filed 2003·Granted Nov 29, 2005·4 cites·39 claims
- 3143US6821684B2Method for fabricating mask ROM with self-aligned codingMACRONIX INT CO LTD·Filed 2002·Granted Nov 23, 2004·2 cites·22 claims
- 3242US8072577B2Lithography systems and processesWU TZONG HSIEN·Filed 2006·Granted Dec 6, 2011·0 cites·12 claims
- 3341US7632616B2Controlling system and method for operating the sameMACRONIX INT CO LTD·Filed 2005·Granted Dec 15, 2009·0 cites·19 claims
- 3440US2007054486A1Method for forming openingYANG TA-HUNG·Filed 2005·Application pending·0 cites
- 3540US2007032060A1Method for forming conductive wiring and interconnectsYANG TA-HUNG·Filed 2005·Application pending·0 cites
- 3638US2018337140A13d integrated circuit device having a buttress structure for resisting deformationMACRONIX INT CO LTD·Filed 2017·Application pending·0 cites
- 3737US2004209196A1[microlithographic process]Filed 2003·Application pending·0 cites
- 3837US2011275216A1Two step chemical-mechanical polishing processMACRONIX INT CO LTD·Filed 2010·Application pending·0 cites
- 3935US2018269222A13d memory device with layered conductorsMACRONIX INT CO LTD·Filed 2017·Application pending·0 cites
- 4033US2017076976A1Isolation structure and method for fabricating the sameMACRONIX INT CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →