Inventor · disambiguated record
Shih-Cheng Chang
Also filed as: CHANG SHIH-CHENG
15 granted patents·7 pending applications·92 citations·filing 2005–2023
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG8TAIWAN SEMICONDUCTOR MFG CO LTD7CHANG SHIH-CHENG2IND TECH RES INST2AVERMEDIA TECH INC1
Top patents by PatentIndex Score
22 records- 0192US9105696B1Method of coating surface of substrate hole with layer of reduced graphene oxideNAT UNIV CHUNG HSING·Filed 2014·Granted Aug 11, 2015·28 cites·15 claims
- 0290US9385079B2Methods for forming stacked capacitors with fuse protectionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·14 cites·20 claims
- 0387US7216324B2Method for designing chip package by re-using existing mask designsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 8, 2007·14 cites·13 claims
- 0486US10833034B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 10, 2020·4 cites·20 claims
- 0581US10014252B2Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·4 cites·20 claims
- 0681US9601443B2Test structure for seal ring quality monitorTSAI HAO-YI·Filed 2007·Granted Mar 21, 2017·8 cites·20 claims
- 0777US11164825B2CoWos interposer with selectable/programmable capacitance arraysTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·2 cites·20 claims
- 0875US9269485B2Method of creating spiral inductor having high Q valueCHANG SHIH-CHENG·Filed 2011·Granted Feb 23, 2016·5 cites·4 claims
- 0974US8005326B2Optical clock signal distribution using through-silicon viasTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 23, 2011·5 cites·19 claims
- 1066US11824027B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·18 claims
- 1166US8026567B2Thermoelectric cooler for semiconductor devices with TSVTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Sep 27, 2011·3 cites·19 claims
- 1265US7615487B2Power delivery package having through wafer viasTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 10, 2009·3 cites·15 claims
- 1356US2024258258A1Semiconductor package including ball grid array connections with improved reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1454US7257784B2Method for integrally checking chip and package substrate layouts for errorsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 14, 2007·2 cites·14 claims
- 1549US2015171255A1Solar cell and method of forming the same and method for forming n-type zns layerIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1649US2025070059A1Connector height uniformity over under bump metal (ubm)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1748US8670637B2Optical clock signal distribution using through-silicon viasCHANG SHIH-CHENG·Filed 2011·Granted Mar 11, 2014·0 cites·20 claims
- 1846US2017104125A1METHOD FOR FORMING N-TYPE ZnS LAYER AND SOLAR CELLIND TECH RES INST·Filed 2016·Application pending·0 cites
- 1945US2025028893A1Optimized cell layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2045US2009140383A1Method of creating spiral inductor having high q valueTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 2138US2007235862A1Hybrid flip-chip and wire-bond connection package systemTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 2234US7539094B2Multi-bit stream of multimedia data processingAVERMEDIA TECH INC·Filed 2006·Granted May 26, 2009·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →