Inventor · disambiguated record
Won Duck Jung
Also filed as: JUNG WON DUCK
10 granted patents·3 pending applications·9 citations·filing 2015–2024
80Inventor score
Files withSK HYNIX INC13
Top patents by PatentIndex Score
13 records- 0187US9345136B1Package substrates, semiconductor packages including the same, electronic systems including the same, and memory cards including the sameSK HYNIX INC·Filed 2015·Granted May 17, 2016·7 cites·22 claims
- 0276US2025014999A1Semiconductor packagesSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0371US12131997B2Semiconductor packagesSK HYNIX INC·Filed 2022·Granted Oct 29, 2024·0 cites·10 claims
- 0461US9543384B2Semiconductor packageSK HYNIX INC·Filed 2015·Granted Jan 10, 2017·1 cites·19 claims
- 0559US9668344B2Semiconductor packages having interconnection membersSK HYNIX INC·Filed 2015·Granted May 30, 2017·1 cites·13 claims
- 0659US2021118800A1Semiconductor packagesSK HYNIX INC·Filed 2020·Application pending·0 cites
- 0752US10741529B2Semiconductor packagesSK HYNIX INC·Filed 2018·Granted Aug 11, 2020·0 cites·18 claims
- 0851US11233033B2Semiconductor packages including chips stacked on a base moduleSK HYNIX INC·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 0951US10615129B2Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structureSK HYNIX INC·Filed 2018·Granted Apr 7, 2020·0 cites·9 claims
- 1047US10157858B2Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structureSK HYNIX INC·Filed 2017·Granted Dec 18, 2018·0 cites·18 claims
- 1146US10629543B2Package substrates having an electromagnetic bandgap structure and semiconductor packages employing the package substratesSK HYNIX INC·Filed 2018·Granted Apr 21, 2020·0 cites·17 claims
- 1246US10224314B2Semiconductor packagesSK HYNIX INC·Filed 2016·Granted Mar 5, 2019·0 cites·20 claims
- 1344US2021242176A1Semiconductor packagesSK HYNIX INC·Filed 2020·Application pending·0 cites
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