Inventor · disambiguated record
Chien-Ko Liao
Also filed as: LIAO CHIEN-KO
16 granted patents·2 pending applications·24 citations·filing 2007–2022
89Inventor score
Top patents by PatentIndex Score
18 records- 0193US11961770B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·3 cites·20 claims
- 0290US10490463B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·7 cites·20 claims
- 0385US11430108B2Defect offset correctionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·1 cites·20 claims
- 0482US10852704B2Semiconductor equipment management method, electronic device, and non-transitory computer readable storage mediumTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·2 cites·20 claims
- 0578US11842481B2Defect offset correctionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 0676US9063084B1Gas sensor having micro-package structure and method for making the sameLINGSEN PRECISION IND LTD·Filed 2014·Granted Jun 23, 2015·4 cites·11 claims
- 0773US11171065B2Automated inspection toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·1 cites·20 claims
- 0870US10872794B2Automatic in-line inspection systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·1 cites·20 claims
- 0969US7763980B2Semiconductor die having a distribution layerSANDISK CORP·Filed 2007·Granted Jul 27, 2010·3 cites·10 claims
- 1068US11754989B2Semiconductor equipment management method, electronic device, and non-transitory computer readable storage mediumTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 1161US7772047B2Method of fabricating a semiconductor die having a redistribution layerSANDISK CORP·Filed 2007·Granted Aug 10, 2010·2 cites·34 claims
- 1260US10839507B2Defect offset correctionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
- 1351US2015206852A1Copper clad laminate having barrier structure and method of manufacturing the sameLINGSEN PRECISION IND LTD·Filed 2014·Application pending·0 cites
- 1450US7939944B2Semiconductor die having a redistribution layerSANDISK CORP·Filed 2010·Granted May 10, 2011·0 cites·20 claims
- 1545US9553073B2Chip stack structure using conductive film bridge adhesive technologyLINGSEN PRECISION IND LTD·Filed 2014·Granted Jan 24, 2017·0 cites·4 claims
- 1644US8212360B2Semiconductor die having a redistribution layerLIAO CHIEN-KO·Filed 2011·Granted Jul 3, 2012·0 cites·15 claims
- 1744US2015255423A1Copper clad laminate having barrier structure and method of manufacturing the sameLINGSEN PRECISION IND LTD·Filed 2015·Application pending·0 cites
- 1836US9811000B2Photolithography tool and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →