Inventor · disambiguated record
Guruprasad Badakere Govindaiah
Also filed as: BADAKERE GOVINDAIAH GURUPRASAD
6 granted patents·30 citations·filing 2007–2011
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0184US7714419B2Integrated circuit package system with shieldingSTATS CHIPPAC LTD·Filed 2007·Granted May 11, 2010·13 cites·17 claims
- 0280US8072047B2Integrated circuit package system with shield and tie barCAMACHO ZIGMUND RAMIREZ·Filed 2008·Granted Dec 6, 2011·9 cites·20 claims
- 0372US8536690B2Integrated circuit packaging system with cap layer and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Sep 17, 2013·5 cites·20 claims
- 0463US7989931B2Integrated circuit package system with under paddle leadfingersSTATS CHIPPAC LTD·Filed 2007·Granted Aug 2, 2011·2 cites·10 claims
- 0554US8120150B2Integrated circuit package system with dual connectivityBADAKERE GOVINDAIAH GURUPRASAD·Filed 2007·Granted Feb 21, 2012·1 cites·20 claims
- 0645US8153478B2Method for manufacturing integrated circuit package system with under paddle leadfingersBADAKERE GOVINDAIAH GURUPRASAD·Filed 2011·Granted Apr 10, 2012·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →