Inventor · disambiguated record
Takatoshi Takikawa
Also filed as: TAKIKAWA TAKATOSHI
12 granted patents·2 pending applications·312 citations·filing 1992–2004
93Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES10INTEL CORP1ITAMI WORKS OF SUMITOMO ELECTR1SUMITOMO ELECTRIC SINTERED ALY1SUMOTOMO ELECTRIC IND LTD1
Top patents by PatentIndex Score
14 records- 0191US5643834AProcess for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layersSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Jul 1, 1997·121 cites·6 claims
- 0280US6388273B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted May 14, 2002·21 cites·1 claims
- 0375US6380832B2Electromagnetic actuatorITAMI WORKS OF SUMITOMO ELECTR·Filed 2000·Granted Apr 30, 2002·20 cites·5 claims
- 0472US6183874B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Feb 6, 2001·28 cites·14 claims
- 0571US5455453APlastic package type semiconductor device having a rolled metal substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Oct 3, 1995·40 cites·10 claims
- 0667US6534190B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Mar 18, 2003·9 cites·18 claims
- 0761US5556807AAdvance multilayer molded plastic package using mesic technologyINTEL CORP·Filed 1993·Granted Sep 17, 1996·26 cites·29 claims
- 0860US6371063B2Valve-open-close mechanismSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted Apr 16, 2002·15 cites·10 claims
- 0956US6974558B2Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMOTOMO ELECTRIC IND LTD·Filed 2001·Granted Dec 13, 2005·5 cites·9 claims
- 1055US6962673B2Heat-resistant, creep-resistant aluminum alloy and billet thereof as well as methods of preparing the sameSUMITOMO ELECTRIC SINTERED ALY·Filed 2002·Granted Nov 8, 2005·2 cites·8 claims
- 1149US6367439B1Combination body of shim and camSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Apr 9, 2002·10 cites·6 claims
- 1247US2004175285A1Methods of preparing heat resistant, creep-resistant aluminum alloySUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Application pending·0 cites
- 1346US5369220AWiring board having laminated wiring patternsSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Nov 29, 1994·15 cites·12 claims
- 1442US2005025654A1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →