Inventor · disambiguated record
Chen Cheng Chou
Also filed as: CHOU CHEN-CHENG
21 granted patents·6 pending applications·479 citations·filing 1997–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG12CORETRONIC CORP6TAIWAN SEMICONDUCTOR MFG CO LTD5LIN CHUAN-YI3CHIN CHAO-CHI1
Top patents by PatentIndex Score
27 records- 0194US8314483B2On-chip heat spreaderLIN CHUAN-YI·Filed 2009·Granted Nov 20, 2012·33 cites·19 claims
- 0294US8168529B2Forming seal ring in an integrated circuit dieLIN CHUAN-YI·Filed 2009·Granted May 1, 2012·34 cites·14 claims
- 0392US5817562AMethod for making improved polysilicon FET gate electrode structures and sidewall spacers for more reliable self-aligned contacts (SAC)TAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Oct 6, 1998·147 cites·24 claims
- 0488US8742583B2Seal ring in an integrated circuit dieLIN CHUAN-YI·Filed 2012·Granted Jun 3, 2014·9 cites·20 claims
- 0586US11551979B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·1 cites·20 claims
- 0683US5766992AProcess for integrating a MOSFET device, using silicon nitride spacers and a self-aligned contact structure, with a capacitor structureTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jun 16, 1998·60 cites·24 claims
- 0781US10818558B2Semiconductor structure having trench and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 27, 2020·2 cites·20 claims
- 0880US12119267B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0980US9570557B2Tilt implantation for STI formation in FinFET structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·3 cites·20 claims
- 1080US5731236AProcess to integrate a self-aligned contact structure, with a capacitor structureTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Mar 24, 1998·49 cites·22 claims
- 1179US11106120B2Projection device and light source system and projection method thereofCORETRONIC CORP·Filed 2019·Granted Aug 31, 2021·3 cites·19 claims
- 1278US8207567B2Metal-oxide-metal structure with improved capacitive coupling areaCHIN CHAO-CHI·Filed 2008·Granted Jun 26, 2012·15 cites·19 claims
- 1376US6348389B1Method of forming and etching a resist protect oxide layer including end-point etchTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Feb 19, 2002·49 cites·6 claims
- 1472US8779572B2On-chip heat spreaderTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 15, 2014·2 cites·20 claims
- 1571US8609506B2On-chip heat spreaderTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 17, 2013·2 cites·20 claims
- 1670US6004841AFabrication process for MOSFET devices and a reproducible capacitor structureTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Dec 21, 1999·26 cites·9 claims
- 1767US5792681AFabrication process for MOSFET devices and a reproducible capacitor structureTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Aug 11, 1998·25 cites·11 claims
- 1860US2025392154A1Power supply switching circuit and power supply switching methodCORETRONIC CORP·Filed 2025·Application pending·0 cites
- 1955US12387637B2Projection device and driving method of projection deviceCORETRONIC CORP·Filed 2024·Granted Aug 12, 2025·0 cites·14 claims
- 2055US2024363461A1Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2152US6346449B1Non-distort spacer profile during subsequent processingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Feb 12, 2002·13 cites·11 claims
- 2246US2006237320A1Method for forming a metal layer in multiple stepsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 2344US2020081332A1Illumination system, projection apparatus and illumination control methodCORETRONIC CORP·Filed 2019·Application pending·0 cites
- 2440US2013002654A1Three-dimensional glasses and method for operating the sameCORETRONIC CORP·Filed 2012·Application pending·0 cites
- 2540US2019384147A1Light detecting element and projection apparatusCORETRONIC CORP·Filed 2019·Application pending·0 cites
- 2639US6284611B1Method for salicide process using a titanium nitride barrier layerTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 4, 2001·6 cites·9 claims
- 2738US6787470B2Sacrificial feature for corrosion prevention during CMPTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 7, 2004·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →