Inventor · disambiguated record
Eiichi Shinada
Also filed as: SHINADA EIICHI
13 granted patents·287 citations·filing 1993–2017
91Inventor score
Top patents by PatentIndex Score
13 records- 0191US6042685AMultiple wire printed circuit board and process for making the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 28, 2000·66 cites·12 claims
- 0290US6121553ACircuit boards using heat resistant resin for adhesive layersHITACHI CHEMICAL CO LTD·Filed 1997·Granted Sep 19, 2000·157 cites·3 claims
- 0363US7870663B2Method for manufacturing multilayer wiring boardHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jan 18, 2011·2 cites·19 claims
- 0460US5403869AAdhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiatorHITACHI CHEMICAL CO LTD·Filed 1993·Granted Apr 4, 1995·17 cites·3 claims
- 0559US5584121AProcess for producing multiple wire wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Dec 17, 1996·12 cites·5 claims
- 0658US9446576B2Adhesive agent, adhesive material using the same, and method of use thereofMASUDA KATSUYUKI·Filed 2012·Granted Sep 20, 2016·0 cites·8 claims
- 0758US5486655AMultiple wire adhesive on a multiple wire wiring boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Jan 23, 1996·16 cites·2 claims
- 0854US10328683B2Adhesive agent, adhesive material using the same, and method of use thereofMASUDA KATSUYUKI·Filed 2012·Granted Jun 25, 2019·0 cites·22 claims
- 0954US10322572B2Adhesive agent, adhesive material using the same, and method of use thereofMASUDA KATSUYUKI·Filed 2012·Granted Jun 18, 2019·0 cites·19 claims
- 1044US5928757AMultiple wire printed circuit board and process for making the sameHITACHI CHEMICAL CO LTD·Filed 1996·Granted Jul 27, 1999·9 cites·9 claims
- 1139US5932351AHeat resistant resin composition and adhesive sheet using the sameHITACHI CHEMICAL CO LTD·Filed 1997·Granted Aug 3, 1999·8 cites·13 claims
- 1233US11240915B2Method for manufacturing multilayer wiring boardLINCSTECH CO LTD·Filed 2017·Granted Feb 1, 2022·0 cites·14 claims
- 1331US11291124B2Method for manufacturing multilayer wiring boardLINCSTECH CO LTD·Filed 2017·Granted Mar 29, 2022·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →