Inventor · disambiguated record
Wei-Chih Chen
Also filed as: CHEN WEI · CHEN WEI C · CHEN WEI-CHIH
182 granted patents·90 pending applications·976 citations·filing 1989–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD83CHEN WEI CHIH19YUNG TA HARDWARE & PLASTIC CO10LITE ON ELECTRONICS GUANGZHOU9SERIPHY TECH CORPORATION9
Top patents by PatentIndex Score
272 records- 0197US11456280B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0297US10212569B1Bluetooth audio communication system and method for acknowledging reception of packets of audio streams at a slave and master devicesPIXART IMAGING INC·Filed 2017·Granted Feb 19, 2019·26 cites·10 claims
- 0397US9848681B1Travel luggage with push and pull functionsCHEN WEI-CHIH·Filed 2017·Granted Dec 26, 2017·35 cites·3 claims
- 0496US11961777B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 0596US11791313B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 0696US11550354B2Systems and methods for multi-phase clock generationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·4 cites·20 claims
- 0796US8487654B1Voltage mode driver with current booster (VMDCB)CHEN WEI CHIH·Filed 2012·Granted Jul 16, 2013·19 cites·20 claims
- 0895US10833053B1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·10 cites·20 claims
- 0995US7084345B1Slide cover unitKINPO ELECT INC·Filed 2005·Granted Aug 1, 2006·52 cites·12 claims
- 1094US12218009B2Semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 1194US10873484B2Device with equaler circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 22, 2020·4 cites·20 claims
- 1293US5928588APorous filter structure and process for the manufacture thereofCUNO INC·Filed 1997·Granted Jul 27, 1999·126 cites·31 claims
- 1393US5882517APorous structuresCUNO INC·Filed 1996·Granted Mar 16, 1999·106 cites·121 claims
- 1492US10510704B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·19 claims
- 1592US10304772B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·7 cites·20 claims
- 1692US6658698B2Handle structure for suitcase or the likeFiled 2001·Granted Dec 9, 2003·56 cites·3 claims
- 1791US11201079B2Wafer chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 14, 2021·6 cites·20 claims
- 1891US6139739AComposite filter elementCUNO INC·Filed 1999·Granted Oct 31, 2000·60 cites·28 claims
- 1990US11609261B2Wafer inspection system and wafer inspection equipment thereofCHROMA ATE INC·Filed 2021·Granted Mar 21, 2023·2 cites·17 claims
- 2090US11404369B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·5 cites·20 claims
- 2189US11417582B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·2 cites·20 claims
- 2289US11270927B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 8, 2022·4 cites·20 claims
- 2389US11031289B2Semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·4 cites·20 claims
- 2489US5045210AHeavy metal removal processCUNO INC·Filed 1989·Granted Sep 3, 1991·56 cites·11 claims
- 2587US11174892B2Screw assembly having enhanced airtight effectCHEN WEI CHIH·Filed 2019·Granted Nov 16, 2021·5 cites·5 claims
- 2687US11164814B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·3 cites·20 claims
- 2786US9550481B2Trailer with a trailer brake control device thereinTUSON (JIAXING) CORP·Filed 2014·Granted Jan 24, 2017·8 cites·11 claims
- 2885US10332856B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 25, 2019·3 cites·20 claims
- 2985US2025133812A1Semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3084US9683393B2System for physically securing an electronic deviceACCO BRANDS CORP·Filed 2015·Granted Jun 20, 2017·6 cites·16 claims
- 3184US8109667B2Backlight module with improved base structure and method for manufacturing the sameWANG PING-FU·Filed 2009·Granted Feb 7, 2012·10 cites·24 claims
- 3283USD963467SHousing of cable fall arresterYOKE IND CORP·Filed 2020·Granted Sep 13, 2022·10 cites·1 claims
- 3383US11404342B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·20 claims
- 3483US6290040B1Soft handle luggageFiled 2000·Granted Sep 18, 2001·35 cites·2 claims
- 3582US12293988B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 6, 2025·0 cites·20 claims
- 3682US12283545B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 3781US12242150B2Electronic deviceINNOLUX CORP·Filed 2023·Granted Mar 4, 2025·0 cites·8 claims
- 3881US9325310B2High-swing voltage mode driverTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 26, 2016·5 cites·20 claims
- 3981US6632991B2Scale indicator for a keyboard instrumentFiled 2002·Granted Oct 14, 2003·21 cites·17 claims
- 4081US2024194569A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4181US2025096059A1Integrated Fan Out Device with a Filler-Free Insulating MaterialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4281US2025226317A1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4380US12400876B2Methods of manufacture having redistribution layer using dielectric material photoactive componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 4480US12191222B2Integrated fan out device with a filler-free insulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 4580US11948863B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 2, 2024·0 cites·20 claims
- 4680US11879495B2Thermally insulating fixtureCHEN WEI CHIH·Filed 2021·Granted Jan 23, 2024·1 cites·10 claims
- 4780US8995597B2Digital second-order CDR circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 31, 2015·5 cites·27 claims
- 4880US2024387194A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4978US11948904B2Die and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 5078US11768516B2Systems and methods for multi-phase clock generationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
Showing the top 50 of 272 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →