Inventor · disambiguated record
Keiji Saeki
Also filed as: SAEKI KEIJI
12 granted patents·576 citations·filing 1982–1996
94Inventor score
Top patents by PatentIndex Score
12 records- 0186US5550408ASemiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1995·Granted Aug 27, 1996·98 cites·5 claims
- 0285US5813115AMethod of mounting a semiconductor chip on a wiring substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 29, 1998·92 cites·2 claims
- 0385US5667129AIC component mounting method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 16, 1997·81 cites·16 claims
- 0484US5436503ASemiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1993·Granted Jul 25, 1995·72 cites·2 claims
- 0580US5744382AMethod of packaging electronic chip component and method of bonding of electrode thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Apr 28, 1998·55 cites·24 claims
- 0677US4692351AMethod and apparatus for drawing a thick film circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1985·Granted Sep 8, 1987·36 cites·10 claims
- 0772US5622590ASemiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1995·Granted Apr 22, 1997·39 cites·14 claims
- 0870US4743465AMethod and apparatus for drawing thick film circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1985·Granted May 10, 1988·27 cites·21 claims
- 0969US5646439AElectronic chip component with passivation film and organic protective filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 8, 1997·33 cites·4 claims
- 1054US4824010AProcess and apparatus for soldering printed circuit boardsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Apr 25, 1989·16 cites·29 claims
- 1151US5240170AMethod for bonding lead of IC component with electrodeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Aug 31, 1993·20 cites·6 claims
- 1241US4425209APhotosetting resin compositionsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1982·Granted Jan 10, 1984·7 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →