Inventor · disambiguated record
David Mui
Also filed as: MUI DAVID · MUI DAVID S · MUI DAVID S L
68 granted patents·18 pending applications·2,583 citations·filing 1997–2023
99Inventor score
Top patents by PatentIndex Score
86 records- 0199US6924191B2Method for fabricating a gate structure of a field effect transistorAPPLIED MATERIALS INC·Filed 2003·Granted Aug 2, 2005·452 cites·20 claims
- 0298US6699399B1Self-cleaning etch processAPPLIED MATERIALS INC·Filed 2000·Granted Mar 2, 2004·500 cites·72 claims
- 0397US6677242B1Integrated shallow trench isolation approachAPPLIED MATERIALS INC·Filed 2000·Granted Jan 13, 2004·242 cites·11 claims
- 0496US6235643B1Method for etching a trench having rounded top and bottom corners in a silicon substrateAPPLIED MATERIALS INC·Filed 1999·Granted May 22, 2001·305 cites·32 claims
- 0594US6136211ASelf-cleaning etch processAPPLIED MATERIALS INC·Filed 1997·Granted Oct 24, 2000·160 cites·43 claims
- 0693US9069563B2Reducing store-hit-loads in an out-of-order processorKONIGSBURG BRIAN R·Filed 2011·Granted Jun 30, 2015·32 cites·20 claims
- 0793US7779232B2Method and apparatus for dynamically managing instruction buffer depths for non-predicted branchesIBM·Filed 2007·Granted Aug 17, 2010·56 cites·20 claims
- 0893US6960416B2Method and apparatus for controlling etch processes during fabrication of semiconductor devicesAPPLIED MATERIALS INC·Filed 2003·Granted Nov 1, 2005·65 cites·18 claims
- 0991US7498106B2Method and apparatus for controlling etch processes during fabrication of semiconductor devicesAPPLIED MATERIALS INC·Filed 2005·Granted Mar 3, 2009·18 cites·18 claims
- 1091US6180533B1Method for etching a trench having rounded top corners in a silicon substrateAPPLIED MATERIALS INC·Filed 2000·Granted Jan 30, 2001·71 cites·25 claims
- 1190US8943299B2Operating a stack of information in an information handling systemEKANADHAM KATTAMURI·Filed 2010·Granted Jan 27, 2015·17 cites·23 claims
- 1290US8617993B2Method of reducing pattern collapse in high aspect ratio nanostructuresYASSERI AMIR A·Filed 2010·Granted Dec 31, 2013·22 cites·11 claims
- 1388US10861719B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2020·Granted Dec 8, 2020·2 cites·11 claims
- 1488US10720343B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Jul 21, 2020·5 cites·21 claims
- 1587US8227394B2Composition of a cleaning material for particle removalZHU JI·Filed 2008·Granted Jul 24, 2012·12 cites·20 claims
- 1686US7094613B2Method for controlling accuracy and repeatability of an etch processAPPLIED MATERIALS INC·Filed 2003·Granted Aug 22, 2006·36 cites·20 claims
- 1784US6911399B2Method of controlling critical dimension microloading of photoresist trimming process by selective sidewall polymer depositionAPPLIED MATERIALS INC·Filed 2003·Granted Jun 28, 2005·29 cites·17 claims
- 1884US6858361B2Methodology for repeatable post etch CD in a production toolFiled 2002·Granted Feb 22, 2005·34 cites·33 claims
- 1984US6037265AEtchant gas and a method for etching transistor gatesAPPLIED MATERIALS INC·Filed 1998·Granted Mar 14, 2000·54 cites·91 claims
- 2083US6566270B1Integration of silicon etch and chamber cleaning processesAPPLIED MATERIALS INC·Filed 2000·Granted May 20, 2003·31 cites·26 claims
- 2181US10446416B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Oct 15, 2019·3 cites·19 claims
- 2281US6317811B1Method and system for reissuing load requests in a multi-stream prefetch designIBM·Filed 1999·Granted Nov 13, 2001·95 cites·25 claims
- 2380US6458671B1Method of providing a shallow trench in a deep-trench deviceAPPLIED MATERIALS INC·Filed 2001·Granted Oct 1, 2002·26 cites·24 claims
- 2479US6589879B2Nitride open etch process based on trifluoromethane and sulfur hexafluorideAPPLIED MATERIALS INC·Filed 2001·Granted Jul 8, 2003·23 cites·29 claims
- 2577US9052910B2Efficiency of short loop instruction fetchHALL RONALD·Filed 2008·Granted Jun 9, 2015·9 cites·21 claims
- 2677US6924088B2Method and system for realtime CD microloading controlAPPLIED MATERIALS INC·Filed 2003·Granted Aug 2, 2005·19 cites·59 claims
- 2773US8211846B2Materials for particle removal by single-phase and two-phase mediaMUI DAVID S L·Filed 2008·Granted Jul 3, 2012·3 cites·19 claims
- 2873US8084406B2Apparatus for particle removal by single-phase and two-phase mediaMUI DAVID S L·Filed 2008·Granted Dec 27, 2011·3 cites·11 claims
- 2972US7967019B2Method and apparatus for removing contaminants from substrateLAM RES CORP·Filed 2008·Granted Jun 28, 2011·2 cites·10 claims
- 3072US6849151B2Monitoring substrate processing by detecting reflectively diffracted lightFiled 2002·Granted Feb 1, 2005·11 cites·9 claims
- 3171US9159593B2Method of particle contaminant removalKAWAGUCHI MARK NAOSHI·Filed 2009·Granted Oct 13, 2015·4 cites·18 claims
- 3271US7107376B2Systems and methods for bandwidth shapingTOSHIBA AMERICA ELECTRONIC·Filed 2004·Granted Sep 12, 2006·15 cites·31 claims
- 3370US7444435B2Non-fenced list DMA command mechanismIBM·Filed 2007·Granted Oct 28, 2008·4 cites·18 claims
- 3470US6653237B2High resist-selectivity etch for silicon trench etch applicationsAPPLIED MATERIALS INC·Filed 2001·Granted Nov 25, 2003·13 cites·23 claims
- 3569US11823892B2Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structuresLAM RES AG·Filed 2019·Granted Nov 21, 2023·1 cites·24 claims
- 3669US8758522B2Method and apparatus for removing contaminants from substrateZHU JI·Filed 2011·Granted Jun 24, 2014·1 cites·18 claims
- 3767US7250373B2Method and apparatus for etching material layers with high uniformity of a lateral etch rate across a substrateAPPLIED MATERIALS INC·Filed 2004·Granted Jul 31, 2007·8 cites·4 claims
- 3867US6589715B2Process for depositing and developing a plasma polymerized organosilicon photoresist filmFRANCE TELECOM·Filed 2001·Granted Jul 8, 2003·10 cites·17 claims
- 3966US2024038526A1Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structuresLAM RES AG·Filed 2023·Application pending·0 cites
- 4064US9395995B2Retrieving instructions of a single branch, backwards short loop from a virtual loop bufferHALL RONALD·Filed 2012·Granted Jul 19, 2016·1 cites·16 claims
- 4164US7644198B2DMAC translation mechanismIBM·Filed 2005·Granted Jan 5, 2010·4 cites·22 claims
- 4264US7262865B2Method and apparatus for controlling a calibration cycle or a metrology toolAPPLIED MATERIALS INC·Filed 2004·Granted Aug 28, 2007·9 cites·15 claims
- 4364US6484220B1Transfer of data between processors in a multi-processor systemIBM·Filed 1999·Granted Nov 19, 2002·42 cites·35 claims
- 4463US8105997B2Composition and application of a two-phase contaminant removal mediumZHU JI·Filed 2008·Granted Jan 31, 2012·1 cites·16 claims
- 4563US6449698B1Method and system for bypass prefetch data pathIBM·Filed 1999·Granted Sep 10, 2002·39 cites·17 claims
- 4662US7482178B2Chamber stability monitoring using an integrated metrology toolAPPLIED MATERIALS INC·Filed 2003·Granted Jan 27, 2009·8 cites·6 claims
- 4759US8585825B2Acoustic assisted single wafer wet clean for semiconductor wafer processPENG GRANT·Filed 2008·Granted Nov 19, 2013·2 cites·18 claims
- 4857US6632321B2Method and apparatus for monitoring and controlling wafer fabrication processAPPLIED MATERIALS INC·Filed 1999·Granted Oct 14, 2003·21 cites·21 claims
- 4957US6134684AMethod and system for error detection in test units utilizing pseudo-random dataIBM·Filed 1998·Granted Oct 17, 2000·31 cites·16 claims
- 5056US6703315B2Method of providing a shallow trench in a deep-trench deviceAPPLIED MATERIALS INC·Filed 2002·Granted Mar 9, 2004·6 cites·5 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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