Inventor · disambiguated record
Jonathan Hale Hammond
Also filed as: HAMMOND JONATHAN · HAMMOND JONATHAN H · HAMMOND JONATHAN HALE
36 granted patents·5 pending applications·325 citations·filing 1996–2024
97Inventor score
Files withQORVO US INC14RF MICRO DEVICES INC12HAMMOND JONATHAN HALE5MOTOROLA INC5FREESCALE SEMICONDUCTOR INC2
Top patents by PatentIndex Score
41 records- 0197US10882740B2Wafer-level package with enhanced performance and manufacturing method thereofQORVO US INC·Filed 2019·Granted Jan 5, 2021·25 cites·16 claims
- 0295US8564387B1Thermally tolerant anchor configuration for a circular cantileverRF MICRO DEVICES INC·Filed 2012·Granted Oct 22, 2013·10 cites·6 claims
- 0394US9960145B2Flip chip module with enhanced propertiesQORVO US INC·Filed 2016·Granted May 1, 2018·15 cites·25 claims
- 0493US8570122B1Thermally compensating dieletric anchors for microstructure devicesHAMMOND JONATHAN HALE·Filed 2010·Granted Oct 29, 2013·12 cites·27 claims
- 0592US7863071B1Combined micro-electro-mechanical systems device and integrated circuit on a silicon-on-insulator waferRF MICRO DEVICES INC·Filed 2007·Granted Jan 4, 2011·24 cites·20 claims
- 0692US7745892B1Integrated MEMS switchRF MICRO DEVICES INC·Filed 2007·Granted Jun 29, 2010·29 cites·21 claims
- 0791US7268463B2Stress release mechanism in MEMS device and method of making sameFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 11, 2007·25 cites·9 claims
- 0888US7985611B1Method for manufacturing integrated MEMS resonator deviceRF MICRO DEVICES INC·Filed 2010·Granted Jul 26, 2011·9 cites·19 claims
- 0987US9991065B2Contact MEMS architecture for improved cycle count and hot-switching and ESDQORVO US INC·Filed 2016·Granted Jun 5, 2018·3 cites·20 claims
- 1086US8680955B1Thermally neutral anchor configuration for an electromechanical actuatorHAMMOND JONATHAN HALE·Filed 2010·Granted Mar 25, 2014·7 cites·13 claims
- 1183US9156677B2Shunt switch at common port to reduce hot switchingRF MICRO DEVICES INC·Filed 2013·Granted Oct 13, 2015·4 cites·22 claims
- 1281US9979433B2RF front-end circuitry with transistor and microelectromechanical multiple throw switchesQORVO US INC·Filed 2013·Granted May 22, 2018·3 cites·25 claims
- 1380US7868403B1Integrated MEMS resonator deviceRF MICRO DEVICES INC·Filed 2007·Granted Jan 11, 2011·9 cites·5 claims
- 1479US8314467B1Thermally tolerant electromechanical actuatorsHAMMOND JONATHAN HALE·Filed 2010·Granted Nov 20, 2012·3 cites·18 claims
- 1576US10773952B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Sep 15, 2020·2 cites·22 claims
- 1676US10770253B2Switch arrangements for microelectromechanical systemsQORVO US INC·Filed 2018·Granted Sep 8, 2020·1 cites·20 claims
- 1775US8354901B1Thermally tolerant anchor configuration for a circular cantileverRF MICRO DEVICES INC·Filed 2010·Granted Jan 15, 2013·2 cites·13 claims
- 1872US5747839AChemical sensing trench field effect transistorMOTOROLA INC·Filed 1996·Granted May 5, 1998·37 cites·6 claims
- 1969US11069590B2Wafer-level fan-out package with enhanced performanceQORVO US INC·Filed 2019·Granted Jul 20, 2021·1 cites·20 claims
- 2069US10964554B2Wafer-level fan-out package with enhanced performanceQORVO US INC·Filed 2019·Granted Mar 30, 2021·1 cites·22 claims
- 2169US10486963B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Nov 26, 2019·1 cites·22 claims
- 2269US9159516B2Actuation signal for microactuator bounce and ring suppressionHAMMOND JONATHAN HALE·Filed 2011·Granted Oct 13, 2015·2 cites·22 claims
- 2367US5892252AChemical sensing trench field effect transistor and method for sameMOTOROLA INC·Filed 1998·Granted Apr 6, 1999·30 cites·15 claims
- 2466US10486965B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Nov 26, 2019·1 cites·23 claims
- 2564US7000473B2MEM structure having reduced spring stictionFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Feb 21, 2006·15 cites·24 claims
- 2662US6122963AElectronic component for measuring accelerationMOTOROLA INC·Filed 1999·Granted Sep 26, 2000·22 cites·17 claims
- 2762US2024404996A1Package with vertically stacked devices, and fabrication methods thereofQORVO US INC·Filed 2024·Application pending·0 cites
- 2857US6228275B1Method of manufacturing a sensorMOTOROLA INC·Filed 1998·Granted May 8, 2001·17 cites·17 claims
- 2955US9859076B2Encapsulated micro-electromechanical system switch and method of manufacturing the sameRF MICRO DEVICES INC·Filed 2015·Granted Jan 2, 2018·0 cites·22 claims
- 3055US2014015731A1Contact mems architecture for improved cycle count and hot-switching and esdRF MICRO DEVICES INC·Filed 2013·Application pending·0 cites
- 3154US10804179B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2018·Granted Oct 13, 2020·0 cites·17 claims
- 3254US5914521ASensor devices having a movable structureMOTOROLA INC·Filed 1997·Granted Jun 22, 1999·15 cites·17 claims
- 3353US9284185B2Integrated circuit switches, design structure and methods of fabricating the sameIBM·Filed 2013·Granted Mar 15, 2016·0 cites·16 claims
- 3453US2024199411A1Vertically stacked mems devices and controller deviceQORVO US INC·Filed 2022·Application pending·0 cites
- 3552US9892879B2Encapsulated micro-electromechanical system switch and method of manufacturing the sameHAMMOND JONATHAN HALE·Filed 2012·Granted Feb 13, 2018·0 cites·28 claims
- 3652US9475692B2Radio frequency (RF) microelectromechanical systems (MEMS) devices with gold-doped siliconRF MICRO DEVICES INC·Filed 2015·Granted Oct 25, 2016·0 cites·15 claims
- 3751US10109550B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Oct 23, 2018·0 cites·17 claims
- 3838US2012193781A1Customized rf mems capacitor array using redistribution layerCOSTA JULIO·Filed 2011·Application pending·0 cites
- 3934US9688529B2Glass wafer assemblyRF MICRO DEVICES INC·Filed 2015·Granted Jun 27, 2017·0 cites·5 claims
- 4033US10759660B2Method for processing product wafers using carrier substratesRF MICRO DEVICES INC·Filed 2015·Granted Sep 1, 2020·0 cites·16 claims
- 4133US2007090474A1MEMS device and method of fabricationLI GARY G·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →