Inventor · disambiguated record
Hideyuki Sandoh
Also filed as: SANDOH HIDEYUKI
9 granted patents·4 pending applications·6 citations·filing 2004–2022
77Inventor score
Files withDISCO CORP12
Top patents by PatentIndex Score
13 records- 0186US11056346B2Wafer processing methodDISCO CORP·Filed 2020·Granted Jul 6, 2021·2 cites·3 claims
- 0266US10410923B2Method of processing waferDISCO CORP·Filed 2017·Granted Sep 10, 2019·1 cites·4 claims
- 0366US10083867B2Method of processing a waferDISCO CORP·Filed 2017·Granted Sep 25, 2018·1 cites·3 claims
- 0452US12341068B2Method of manufacturing chipsDISCO CORP·Filed 2022·Granted Jun 24, 2025·0 cites·8 claims
- 0551US11894271B2Method of processing waferDISCO CORP·Filed 2021·Granted Feb 6, 2024·0 cites·3 claims
- 0648US11495466B2Processing method of waferDISCO CORP·Filed 2020·Granted Nov 8, 2022·0 cites·5 claims
- 0746US11628515B2Processing apparatus for processing workpieceDISCO CORP·Filed 2020·Granted Apr 18, 2023·0 cites·16 claims
- 0846US7222772B2Flip chip bonderDISCO CORP·Filed 2004·Granted May 29, 2007·2 cites·2 claims
- 0942US2021043474A1Plasma etching apparatusDISCO CORP·Filed 2020·Application pending·0 cites
- 1041US10811458B2Method of processing waferDISCO CORP·Filed 2018·Granted Oct 20, 2020·0 cites·17 claims
- 1138US2018330957A1Workpiece processing methodDISCO CORP·Filed 2018·Application pending·0 cites
- 1237US2004208718A1Machine for processing electrodes formed on a plate-like workpieceFiled 2004·Application pending·0 cites
- 1335US2018096892A1Device wafer processing methodDISCO CORP·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hideyuki Sandoh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →