Inventor · disambiguated record
Soyoun Lee
Also filed as: LEE SOYOUN
6 granted patents·1 pending application·15 citations·filing 2020–2023
75Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0196US11404395B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·8 cites·18 claims
- 0295US11244927B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 8, 2022·4 cites·20 claims
- 0394US11721673B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·3 cites·20 claims
- 0469US11791308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 0569US11764192B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 0662US11362062B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 0751US2024128221A1Semiconductor package including bumps with a plurality of separation distancesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →