Inventor · disambiguated record
Jihwan Suh
Also filed as: SUH JIHWAN
10 granted patents·3 pending applications·16 citations·filing 2020–2024
83Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0196US11404395B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·8 cites·18 claims
- 0295US11244927B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 8, 2022·4 cites·20 claims
- 0394US11721673B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·3 cites·20 claims
- 0479US11658148B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 23, 2023·1 cites·20 claims
- 0577US2024332255A1Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0676US12040313B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0769US11955449B2Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 0869US11791308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 0969US11764192B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1063US11508685B2Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1162US11362062B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 1259US2025105216A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1358US2024421016A1Semiconductor package and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →