Inventor · disambiguated record
Masanaga Fukasawa
Also filed as: FUKASAWA MASANAGA
19 granted patents·11 pending applications·146 citations·filing 2000–2023
94Inventor score
Top patents by PatentIndex Score
30 records- 0194US10157837B2Semiconductor device and manufacturing method of the sameSONY CORP·Filed 2017·Granted Dec 18, 2018·7 cites·20 claims
- 0294US9859214B2Semiconductor device and manufacturing method of the sameSONY CORP·Filed 2017·Granted Jan 2, 2018·8 cites·20 claims
- 0393US9627359B2Semiconductor device and manufacturing method of the sameSONY CORP·Filed 2016·Granted Apr 18, 2017·7 cites·17 claims
- 0493US9425142B2Semiconductor device and manufacturing method of the sameSONY CORP·Filed 2015·Granted Aug 23, 2016·7 cites·20 claims
- 0592US6407011B1Low dielectric constant insulating films with laminated carbon-containing silicon oxide and organic layersSONY CORP·Filed 2000·Granted Jun 18, 2002·69 cites·11 claims
- 0691US10026769B2Semiconductor device and solid-state imaging deviceSONY CORP·Filed 2014·Granted Jul 17, 2018·12 cites·14 claims
- 0791US9293411B2Semiconductor device and manufacturing method of the sameSONY CORP·Filed 2014·Granted Mar 22, 2016·8 cites·4 claims
- 0890US10504839B2Semiconductor device and manufacturing method of the sameSONY CORP·Filed 2018·Granted Dec 10, 2019·4 cites·11 claims
- 0987US8871633B2Semiconductor device and manufacturing method of the sameFUKASAWA MASANAGA·Filed 2012·Granted Oct 28, 2014·8 cites·15 claims
- 1071US7300868B2Damascene interconnection having porous low k layer with a hard mask reduced in thicknessSONY CORP·Filed 2006·Granted Nov 27, 2007·5 cites·19 claims
- 1170US10804313B2Semiconductor device and solid-state imaging deviceSONY CORP·Filed 2018·Granted Oct 13, 2020·1 cites·12 claims
- 1263US6638848B1Method of etching insulating film and method of forming interconnection layerSONY CORP·Filed 2000·Granted Oct 28, 2003·7 cites·5 claims
- 1357US2025107259A1Imaging device and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 1454US2024363657A1Imaging device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1553US6943104B2Method of etching insulating film and method of forming interconnection layerSONY CORP·Filed 2003·Granted Sep 13, 2005·3 cites·6 claims
- 1653US2025022902A1Semiconductor device, manufacturing method therefor, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1752US2025022897A1Light detection device and optical filterSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 1852US2024196714A1Display device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1951US12074030B2Etching method of oxide semiconductor film, oxide semiconductor workpiece, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Aug 27, 2024·0 cites·18 claims
- 2049US12062548B2Etching method for oxide semiconductor filmSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Aug 13, 2024·0 cites·6 claims
- 2148US11017987B2Etching method and etching processing apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted May 25, 2021·0 cites·12 claims
- 2247US2024213086A1Semiconductor device and etching methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 2347US2021296384A1Semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Application pending·0 cites
- 2446US2009047793A1Method of manufacturing semiconductor deviceSONY CORP·Filed 2008·Application pending·0 cites
- 2544US11798965B2Solid-state imaging device and method for manufacturing the sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Oct 24, 2023·0 cites·12 claims
- 2643US9287097B2Predicting ultraviolet ray damage with visible wavelength spectroscopy during a semiconductor manufacturing processSONY CORP·Filed 2012·Granted Mar 15, 2016·0 cites·14 claims
- 2742US2022375763A1Semiconductor device and etching methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Application pending·0 cites
- 2840US8586468B2Integrated circuit chip stack employing carbon nanotube interconnectsNOGAMI TAKESHI·Filed 2005·Granted Nov 19, 2013·0 cites·6 claims
- 2939US2007232047A1Damage recovery method for low K layer in a damascene interconnectionFUKASAWA MASANAGA·Filed 2006·Application pending·0 cites
- 3038US2007222076A1Single or dual damascene structure reducing or eliminating the formation of micro-trenches arising from lithographic misalignmentFUKASAWA MASANAGA·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →