Inventor · disambiguated record
Shintaro Matsuda
Also filed as: MATSUDA SHINTARO
11 granted patents·2 pending applications·54 citations·filing 1991–2023
86Inventor score
Files withYAZAKI CORP7AISIN CORP2RENESAS ELECTRONICS CORP2MITSUBISHI ELECTRIC CORP1RENESAS TECH CORP1
Top patents by PatentIndex Score
13 records- 0184US9324763B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 26, 2016·5 cites·11 claims
- 0278US6748704B2Factory layoutRENESAS TECH CORP·Filed 2001·Granted Jun 15, 2004·31 cites·14 claims
- 0376US10476203B2ConnectorYAZAKI CORP·Filed 2018·Granted Nov 12, 2019·4 cites·8 claims
- 0465US10559924B2ConnectorYAZAKI CORP·Filed 2019·Granted Feb 11, 2020·2 cites·2 claims
- 0564US10290971B2Connector fitting detection structure and connectorYAZAKI CORP·Filed 2018·Granted May 14, 2019·2 cites·4 claims
- 0658US10784619B2Spring type connectorYAZAKI CORP·Filed 2017·Granted Sep 22, 2020·1 cites·9 claims
- 0753US12385555B2Vehicle drive device and method for manufacturing planetary gear mechanismAISIN CORP·Filed 2023·Granted Aug 12, 2025·0 cites·9 claims
- 0852US11189978B2Connector and wire harnessYAZAKI CORP·Filed 2020·Granted Nov 30, 2021·0 cites·4 claims
- 0949US2022013958A1ConnectorYAZAKI CORP·Filed 2021·Application pending·0 cites
- 1048US9837466B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 5, 2017·0 cites·19 claims
- 1145US12338884B2Vehicle drive deviceAISIN CORP·Filed 2023·Granted Jun 24, 2025·0 cites·4 claims
- 1245US2020373711A1Connector and wire harnessYAZAKI CORP·Filed 2020·Application pending·0 cites
- 1336US5204540AResin sealed semiconductor device for use in testing and evaluation method of stress due to resin sealMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Apr 20, 1993·9 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →