Inventor · disambiguated record
Alexandros Margomenos
Also filed as: MARGOMENOS ALEXANDROS · MARGOMENOS ALEXANDROS D
44 granted patents·6 pending applications·797 citations·filing 2002–2024
98Inventor score
Files withHRL LAB LLC15TOYOTA ENG & MFG NORTH AMERICA14EMAG TECHNOLOGIES INC4INFINEON TECHNOLOGIES AG3MARGOMENOS ALEXANDROS3
Top patents by PatentIndex Score
50 records- 0198US9866259B1Transmitter/receiver module for millimeter wave 5G MIMO communication systemsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 9, 2018·40 cites·16 claims
- 0298US9385083B1Wafer-level die to package and die to die interconnects suspended over integrated heat sinksHRL LAB LLC·Filed 2015·Granted Jul 5, 2016·52 cites·14 claims
- 0398US7733265B2Three dimensional integrated automotive radars and methods of manufacturing the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2008·Granted Jun 8, 2010·104 cites·21 claims
- 0497US9214404B1Apparatus for mounting microelectronic chipsHRL LAB LLC·Filed 2013·Granted Dec 15, 2015·26 cites·27 claims
- 0597US8617927B1Method of mounting electronic chipsMARGOMENOS ALEXANDROS D·Filed 2011·Granted Dec 31, 2013·75 cites·27 claims
- 0696US9837372B1Wafer-level die to package and die to die interconnects suspended over integrated heat sinksHRL LAB LLC·Filed 2016·Granted Dec 5, 2017·16 cites·18 claims
- 0796US9508652B1Direct IC-to-package wafer level packaging with integrated thermal heat spreadersHRL LAB LLC·Filed 2015·Granted Nov 29, 2016·25 cites·20 claims
- 0896US9337124B1Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafersHRL LAB LLC·Filed 2014·Granted May 10, 2016·34 cites·33 claims
- 0995US10079160B1Surface mount package for semiconductor devices with embedded heat spreadersHRL LAB LLC·Filed 2014·Granted Sep 18, 2018·21 cites·31 claims
- 1095US9142626B1Stepped field plate wide bandgap field-effect transistor and methodHRL LAB LLC·Filed 2013·Granted Sep 22, 2015·18 cites·15 claims
- 1195US8022861B2Dual-band antenna array and RF front-end for mm-wave imager and radarTOYOTA ENG & MFG NORTH AMERICA·Filed 2009·Granted Sep 20, 2011·33 cites·20 claims
- 1294US8089327B2Waveguide to plural microstrip transitionMARGOMENOS ALEXANDROS·Filed 2009·Granted Jan 3, 2012·37 cites·9 claims
- 1393US8305259B2Dual-band antenna array and RF front-end for mm-wave imager and radarMARGOMENOS ALEXANDROS·Filed 2011·Granted Nov 6, 2012·15 cites·20 claims
- 1493US8305255B2Dual-band antenna array and RF front-end for MM-wave imager and radarMARGOMENOS ALEXANDROS·Filed 2011·Granted Nov 6, 2012·15 cites·20 claims
- 1593US8013784B2Butler matrix for 3D integrated RF front-endsTOYOTA ENG & MFG NORTH AMERICA·Filed 2009·Granted Sep 6, 2011·53 cites·20 claims
- 1692US9496197B1Near junction cooling for GaN devicesMICOVIC MIROSLAV·Filed 2014·Granted Nov 15, 2016·16 cites·13 claims
- 1792US9059140B1Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devicesHRL LAB LLC·Filed 2013·Granted Jun 16, 2015·9 cites·10 claims
- 1892US7855691B2Automotive radar using a metamaterial lensTOYOTA ENG & MFG NORTH AMERICA·Filed 2008·Granted Dec 21, 2010·31 cites·23 claims
- 1992US7830301B2Dual-band antenna array and RF front-end for automotive radarsTOYOTA ENG & MFG NORTH AMERICA·Filed 2008·Granted Nov 9, 2010·25 cites·21 claims
- 2090US11121731B2Digital radio head controlINTEL CORP·Filed 2019·Granted Sep 14, 2021·5 cites·20 claims
- 2189US10217648B1Fabrication of microfluidic channels in diamondHRL LAB LLC·Filed 2017·Granted Feb 26, 2019·8 cites·20 claims
- 2289US9276529B1High performance GaN operational amplifier with wide bandwidth and high dynamic rangeHRL LAB LLC·Filed 2014·Granted Mar 1, 2016·13 cites·22 claims
- 2388US7928919B2Microwave antenna and method for making sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2010·Granted Apr 19, 2011·6 cites·6 claims
- 2487US9929243B1Stepped field plate wide bandgap field-effect transistor and methodHRL LAB LLC·Filed 2015·Granted Mar 27, 2018·4 cites·17 claims
- 2587US7817097B2Microwave antenna and method for making sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2008·Granted Oct 19, 2010·8 cites·8 claims
- 2687US7760142B2Vertically integrated transceiver arrayEMAG TECHNOLOGIES INC·Filed 2007·Granted Jul 20, 2010·20 cites·31 claims
- 2786US10135483B2Transmitter/receiver module for millimeter wave 5G MIMO communication systemsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 20, 2018·4 cites·4 claims
- 2885US10476546B2Transmitter/receiver module for millimeter wave 5G MIMO communication systemsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 12, 2019·3 cites·10 claims
- 2982US8786496B2Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applicationsRIDA AMIN·Filed 2010·Granted Jul 22, 2014·12 cites·9 claims
- 3082US7986076B2Energy harvesting deviceTOYOTA ENG & MFG NORTH AMERICA·Filed 2009·Granted Jul 26, 2011·10 cites·20 claims
- 3180US9379680B1Systems, methods, and apparatus for a power amplifier moduleBOEING CO·Filed 2013·Granted Jun 28, 2016·6 cites·20 claims
- 3278US7990237B2System and method for improving performance of coplanar waveguide bends at mm-wave frequenciesTOYOTA ENG & MFG NORTH AMERICA·Filed 2009·Granted Aug 2, 2011·8 cites·19 claims
- 3378US7797817B2Microwave component and method for making the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2008·Granted Sep 21, 2010·3 cites·16 claims
- 3477US9331735B1GaN based active cancellation circuit for high power simultaneous transmit and receive systemsHRL LAB LLC·Filed 2014·Granted May 3, 2016·4 cites·21 claims
- 3577US8138019B2Integrated (multilayer) circuits and process of producing the sameYOON SANG WON·Filed 2009·Granted Mar 20, 2012·7 cites·26 claims
- 3676US8378759B2First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there betweenTOYOTA ENG & MFG NORTH AMERICA·Filed 2010·Granted Feb 19, 2013·4 cites·16 claims
- 3776US2025105864A1Adaptive spatial filtering and optimal combining of analog-to-digital converters (adcs) to maximize dynamic range in digital beamforming systemsINTEL CORP·Filed 2024·Application pending·0 cites
- 3869US9780014B1Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devicesHRL LAB LLC·Filed 2015·Granted Oct 3, 2017·1 cites·23 claims
- 3967US6696645B2On-wafer packaging for RF-MEMSUNIV MICHIGAN·Filed 2002·Granted Feb 24, 2004·23 cites·14 claims
- 4062US9093394B1Method and structure for encapsulation and interconnection of transistorsHRL LAB LLC·Filed 2013·Granted Jul 28, 2015·1 cites·11 claims
- 4151US7824997B2Membrane suspended MEMS structuresEMAG TECHNOLOGIES INC·Filed 2008·Granted Nov 2, 2010·2 cites·9 claims
- 4244US10972075B2Active quadrature circuits for high frequency applicationsGM GLOBAL TECH OPERATIONS LLC·Filed 2015·Granted Apr 6, 2021·0 cites·14 claims
- 4344US9553057B1E-plane probe with stepped surface profile for high-frequencyHRL LAB LLC·Filed 2014·Granted Jan 24, 2017·0 cites·23 claims
- 4444US2010238085A1Plastic waveguide slot array and method of manufactureTOYOTA ENG & MFG NORTH AMERICA·Filed 2009·Application pending·0 cites
- 4544US2010134376A1Wideband rf 3d transitionsTOYOTA ENG & MFG NORTH AMERICA·Filed 2008·Application pending·0 cites
- 4641US9584073B1Internally matched active single-to-differential RF converterGM GLOBAL TECH OPERATIONS LLC·Filed 2015·Granted Feb 28, 2017·0 cites·20 claims
- 4741US2010085130A1Manufacturable tunable matching network for wire and ribbon bond compensationTOYOTA ENG & MFG NORTH AMERICA·Filed 2008·Application pending·0 cites
- 4840US2008100394A1Microstrip to Coplanar Waveguide TransitionEMAG TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
- 4939US2008252401A1Evanescent Mode Resonator Including Tunable Capacitive PostEMAG TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
- 5037US8592983B2Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated deviceSHARIFI HASAN·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →