Inventor · disambiguated record
Hsiao-Tsung Lee
Also filed as: LEE HSIAO-TSUNG
7 granted patents·1 pending application·0 citations·filing 2017–2023
67Inventor score
Files withEGALAX_EMPIA TECH INC8
Top patents by PatentIndex Score
8 records- 0173US11640217B2Touch system and touch sensitive processing apparatus and method thereof for detecting whether touch panel is partially submerged in conductive liquidEGALAX_EMPIA TECH INC·Filed 2022·Granted May 2, 2023·0 cites·15 claims
- 0259US11460944B2Touch system and touch sensitive processing apparatus and method thereof for detecting whether touch panel is partially submerged in conductive liquidEGALAX_EMPIA TECH INC·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 0352US11163401B2Electronic device and method thereof for detecting whether component is submerged in conductive liquidEGALAX_EMPIA TECH INC·Filed 2020·Granted Nov 2, 2021·0 cites·25 claims
- 0451US12164764B2Touch sensitive processing apparatus, electronic system and touch sensitive processing method thereofEGALAX_EMPIA TECH INC·Filed 2023·Granted Dec 10, 2024·0 cites·22 claims
- 0547US10234977B2Pressure sensing touch deviceEGALAX_EMPIA TECH INC·Filed 2017·Granted Mar 19, 2019·0 cites·14 claims
- 0643US11449171B2Touch system and touch sensitive processing apparatus and method thereof for detecting whether touch panel is partially submerged in conductive liquidEGALAX_EMPIA TECH INC·Filed 2020·Granted Sep 20, 2022·0 cites·12 claims
- 0743US11301081B2Touch system and touch sensitive processing apparatus and method thereof for detecting whether touch panel is partially submerged in conductive liquidEGALAX_EMPIA TECH INC·Filed 2020·Granted Apr 12, 2022·0 cites·18 claims
- 0840US2017308240A1Pressure sensing touch display deviceEGALAX_EMPIA TECH INC·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hsiao-Tsung Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →