Inventor · disambiguated record
Tsung-Yin Hsieh
Also filed as: HSIEH TSUNG-YIN
10 granted patents·1 pending application·30 citations·filing 2013–2024
84Inventor score
Top patents by PatentIndex Score
11 records- 0192US10438843B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 8, 2019·12 cites·20 claims
- 0288US10373829B1Patterning methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 6, 2019·5 cites·17 claims
- 0387US11450558B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 20, 2022·2 cites·9 claims
- 0484US8907826B2Method for estimating capacitance weight errors and successive approximation analog to digital converter using the sameUNIV NAT CHIAO TUNG·Filed 2013·Granted Dec 9, 2014·11 cites·10 claims
- 0580US2025079237A1Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0674US12183626B2Metal interconnect structure having cap layer with different thicknesses and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 31, 2024·0 cites·9 claims
- 0756US10784153B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 22, 2020·0 cites·10 claims
- 0851US9349822B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 24, 2016·0 cites·17 claims
- 0950US9875927B2Method for forming patterns for semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 23, 2018·0 cites·13 claims
- 1047US9536751B2Method for forming patterns for semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 3, 2017·0 cites·13 claims
- 1133US9583961B2Intellectual power storing system and method for managing battery-array of the intellectual power storing systemKERTIES INT CO LTD·Filed 2015·Granted Feb 28, 2017·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →