Inventor · disambiguated record
Home-Been Cheng
Also filed as: CHENG HOME-BEEN
11 granted patents·2 pending applications·32 citations·filing 2011–2016
86Inventor score
Top patents by PatentIndex Score
13 records- 0187US8518823B2Through silicon via and method of forming the sameHUANG KUO-HSIUNG·Filed 2011·Granted Aug 27, 2013·14 cites·5 claims
- 0286US9502530B2Method of manufacturing semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·4 cites·6 claims
- 0381US8841755B2Through silicon via and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 23, 2014·5 cites·10 claims
- 0476US8753902B1Method of controlling etching process for forming epitaxial structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 17, 2014·3 cites·13 claims
- 0568US8900996B2Through silicon via structure and method of fabricating the sameCHEN HSIN-YU·Filed 2012·Granted Dec 2, 2014·2 cites·10 claims
- 0668US8829575B2Semiconductor structure and process thereofUNITED MICROELECTRONICS CORP·Filed 2012·Granted Sep 9, 2014·2 cites·20 claims
- 0766US9214395B2Method of manufacturing semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 15, 2015·1 cites·9 claims
- 0864US9312208B2Through silicon via structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·1 cites·4 claims
- 0950US9875927B2Method for forming patterns for semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 23, 2018·0 cites·13 claims
- 1047US9536751B2Method for forming patterns for semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 3, 2017·0 cites·13 claims
- 1144US8691688B2Method of manufacturing semiconductor structureCHEN HSIN-YU·Filed 2012·Granted Apr 8, 2014·0 cites·17 claims
- 1239US2013270712A1Through silicon via structure and method of fabricating the sameCHEN HSIN-YU·Filed 2012·Application pending·0 cites
- 1338US2013256843A1Wafer sawing method and wafer structure beneficial for performing the sameCHEN HSIN-YU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →