Inventor · disambiguated record
Tzu-Hao Fu
Also filed as: FU TZU-HAO
6 granted patents·1 pending application·14 citations·filing 2015–2024
74Inventor score
Files withUNITED MICROELECTRONICS CORP7
Top patents by PatentIndex Score
7 records- 0192US10438843B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 8, 2019·12 cites·20 claims
- 0287US11450558B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 20, 2022·2 cites·9 claims
- 0380US2025079237A1Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0474US12183626B2Metal interconnect structure having cap layer with different thicknesses and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 31, 2024·0 cites·9 claims
- 0556US10784153B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 22, 2020·0 cites·10 claims
- 0650US9875927B2Method for forming patterns for semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 23, 2018·0 cites·13 claims
- 0747US9536751B2Method for forming patterns for semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 3, 2017·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →