Inventor · disambiguated record
Daiki Funaoka
Also filed as: FUNAOKA DAIKI
5 granted patents·8 pending applications·10 citations·filing 2009–2022
66Inventor score
Top patents by PatentIndex Score
13 records- 0187US9096782B2Polyesters, polyester compositions, pressure-sensitive adhesive compositions, pressure-sensitive adhesive layers and pressure-sensitive adhesive sheetsTAKAHIRA HITOSHI·Filed 2009·Granted Aug 4, 2015·10 cites·9 claims
- 0267US12473464B2Thermal adhesive laminated oriented filmTOYO BOSEKI·Filed 2021·Granted Nov 18, 2025·0 cites·15 claims
- 0359US2024286394A1Heat-sealable laminated filmTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 0459US2024218132A1Method for producing solid objectTOYOBO MC CORP·Filed 2021·Application pending·0 cites
- 0559US2024239088A1Thermally fusible multilayer filmTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 0653US2024279378A1Thermosetting resin composition containing magnetic powderTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 0752US11014277B2Resin molded article and method for producing resin molded articleTOYO BOSEKI·Filed 2017·Granted May 25, 2021·0 cites·12 claims
- 0851US12240212B2Layered bodyTOYO BOSEKI·Filed 2020·Granted Mar 4, 2025·0 cites·3 claims
- 0947US2023086148A1Rotor core and method of manufacturing rotor coreAISIN CORP·Filed 2021·Application pending·0 cites
- 1041US2023082542A1A crystalline radical polymerizable composition for fixing a magnet of a rotating electric machine rotor core, a rotating electric machine rotor core using the composition, and a method of manufacturing the rotating electric machine rotor coreJAPAN U PICA CO LTD·Filed 2021·Application pending·0 cites
- 1135US9139729B2Resin composition for sealing electrical electronic components, method of producing electrical electronic component, and sealed electrical electronic componentFUNAOKA DAIKI·Filed 2012·Granted Sep 22, 2015·0 cites·8 claims
- 1234US2023318415A1Method for manufacturing rotor coreAISIN CORP·Filed 2021·Application pending·0 cites
- 1329US2014221578A1Resin composition for sealing electrical and electronic parts, method for producing sealed electrical and electronic parts, and sealed electrical and electronic partsFUNAOKA DAIKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →