Inventor · disambiguated record
Whasu Sin
Also filed as: SIN WHASU
4 granted patents·1 pending application·46 citations·filing 2009–2017
72Inventor score
Top patents by PatentIndex Score
5 records- 0192US8998068B2Removal apparatuses for semiconductor chipsPARK JAEYONG·Filed 2012·Granted Apr 7, 2015·42 cites·20 claims
- 0274US9768141B2Removal apparatuses for semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 19, 2017·2 cites·6 claims
- 0351US10629564B2Removal apparatuses for semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 21, 2020·0 cites·7 claims
- 0449US8156636B2Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatusKIM GOON WOO·Filed 2009·Granted Apr 17, 2012·2 cites·13 claims
- 0524US2012087099A1Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Package Including The Same, And Method Of Fabricating The Board-On-Chip PackageMOON TAEHO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →