Inventor · disambiguated record
Wei-Luen Suen
Also filed as: SUEN WEI-LUEN
17 granted patents·10 pending applications·45 citations·filing 2013–2025
90Inventor score
Files withXINTEC INC27
Top patents by PatentIndex Score
27 records- 0191US8952501B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Feb 10, 2015·14 cites·27 claims
- 0290US8963312B2Stacked chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 24, 2015·11 cites·23 claims
- 0384US9355975B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 0479US12473197B2Chip packageXINTEC INC·Filed 2023·Granted Nov 18, 2025·0 cites·19 claims
- 0575US9209124B2Chip packageXINTEC INC·Filed 2013·Granted Dec 8, 2015·3 cites·26 claims
- 0673US9287417B2Semiconductor chip package and method for manufacturing thereofXINTEC INC·Filed 2014·Granted Mar 15, 2016·3 cites·18 claims
- 0768US9437478B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Sep 6, 2016·2 cites·27 claims
- 0868US9425134B2Chip packageXINTEC INC·Filed 2014·Granted Aug 23, 2016·2 cites·21 claims
- 0967US10153237B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Dec 11, 2018·1 cites·22 claims
- 1065US11873212B2Chip package and manufacturing method thereofXINTEC INC·Filed 2021·Granted Jan 16, 2024·0 cites·9 claims
- 1165US9355970B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted May 31, 2016·1 cites·9 claims
- 1263US9640683B2Electrical contact structure with a redistribution layer connected to a studXINTEC INC·Filed 2015·Granted May 2, 2017·1 cites·10 claims
- 1363US9165890B2Chip package comprising alignment mark and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 20, 2015·1 cites·20 claims
- 1463US2025054849A1Chip package and method for forming the sameXINTEC INC·Filed 2024·Application pending·0 cites
- 1562US2025081668A1Chip package and manufacturing method thereofXINTEC INC·Filed 2024·Application pending·0 cites
- 1662US2025056911A1Chip package and manufacturing method thereofXINTEC INC·Filed 2024·Application pending·0 cites
- 1759US11695199B2Antenna device and manufacturing method thereofXINTEC INC·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 1859US2024351865A1Manufacturing method of mems deviceXINTEC INC·Filed 2024·Application pending·0 cites
- 1956US2025372502A1Chip packageXINTEC INC·Filed 2025·Application pending·0 cites
- 2052US11387201B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Jul 12, 2022·0 cites·34 claims
- 2152US11107759B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Aug 31, 2021·0 cites·17 claims
- 2250US9780251B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2017·Granted Oct 3, 2017·0 cites·9 claims
- 2348US2025246530A1Chip package and manufacturing method thereofXINTEC INC·Filed 2025·Application pending·0 cites
- 2446US2021210538A1Chip package and method for forming the sameXINTEC INC·Filed 2020·Application pending·0 cites
- 2546US2015097286A1Chip package and method for fabricating the sameXINTEC INC·Filed 2014·Application pending·0 cites
- 2637US2017148752A1Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 2735US2016355393A1Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →