Inventor · disambiguated record
Hiroto Misawa
Also filed as: MISAWA HIROTO
8 granted patents·4 pending applications·42 citations·filing 1993–2021
83Inventor score
Top patents by PatentIndex Score
12 records- 0191US8710582B2Semiconductor device and method for manufacturing sameOKUMURA HIDEKI·Filed 2012·Granted Apr 29, 2014·16 cites·10 claims
- 0282US8859365B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Oct 14, 2014·4 cites·10 claims
- 0359US7700998B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2008·Granted Apr 20, 2010·2 cites·5 claims
- 0458US9142667B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Sep 22, 2015·0 cites·13 claims
- 0557US2021206965A1Resin composition, molded article and method for producing resin compositionMITSUBISHI CHEM CORP·Filed 2021·Application pending·0 cites
- 0647US2020231730A1Biodegradable acid-modified polyester resin and laminateMITSUBISHI CHEM CORP·Filed 2020·Application pending·0 cites
- 0743US5385851AMethod of manufacturing HEMT device using novolak-based positive-type resistTOSHIBA KK·Filed 1993·Granted Jan 31, 1995·12 cites·1 claims
- 0839US2014035105A1Semiconductor device, method for manufacturing semiconductor device, and base member for semiconductor device formationTOSHIBA KK·Filed 2013·Application pending·0 cites
- 0938US2013153995A1Semiconductor device and method for manufacturing the sameMISAWA HIROTO·Filed 2012·Application pending·0 cites
- 1037US10141399B2Semiconductor deviceTOSHIBA KK·Filed 2015·Granted Nov 27, 2018·0 cites·20 claims
- 1137US5432125AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jul 11, 1995·8 cites·4 claims
- 1236US8173509B2Semiconductor device and method for manufacturing the sameOKUMURA HIDEKI·Filed 2010·Granted May 8, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →