Inventor · disambiguated record
Chin-Yi Cho
Also filed as: CHO CHIN-YI
11 granted patents·23 citations·filing 2012–2021
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7TAIWAN SEMICONDUCTOR MFG2HUANG HSIN-TING1UNIV NAT TSING HUA1
Top patents by PatentIndex Score
11 records- 0190US8841201B2Systems and methods for post-bonding wafer edge sealTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 23, 2014·12 cites·20 claims
- 0285US10779100B2Method for manufacturing a microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·3 cites·20 claims
- 0377US9998843B2Method for manufacturing a microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·1 cites·7 claims
- 0472US9462402B2Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·2 cites·20 claims
- 0572US9264833B2Structure and method for integrated microphoneTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·2 cites·20 claims
- 0668US11678133B2Structure for integrated microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 0768US9269679B2Wafer level packaging techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 23, 2016·2 cites·20 claims
- 0860US9673169B2Method and apparatus for a wafer seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 6, 2017·1 cites·20 claims
- 0955US11820967B2Hanging drop device, formation method of hanging drop and cell culture method by using hanging dropUNIV NAT TSING HUA·Filed 2021·Granted Nov 21, 2023·0 cites·13 claims
- 1052US9545691B2Method of removing waste of substrate and waste removing device thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 17, 2017·0 cites·21 claims
- 1143US8686571B2Bonding layer structure and method for wafer to wafer bondingHUANG HSIN-TING·Filed 2012·Granted Apr 1, 2014·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →