Inventor · disambiguated record
Wei Liu
Also filed as: LIU WEI · LIU WEI-CHEN
89 granted patents·71 pending applications·136 citations·filing 2008–2025
98Inventor score
Files withYANGTZE MEMORY TECH CO LTD110TRINA SOLAR CO LTD14BEIJING BAIDU NETCOM SCI & TECH CO LTD3CORELOGIC SOLUTIONS LLC3AAC TECHNOLOGIES PTE LTD2
Top patents by PatentIndex Score
160 records- 0196US11935596B2Three-dimensional memory devices having polysilicon layer and bonded semiconductor structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 19, 2024·4 cites·20 claims
- 0295US12170258B2Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Dec 17, 2024·3 cites·18 claims
- 0395US12020750B2Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jun 25, 2024·2 cites·17 claims
- 0495US11929119B2Three-dimensional memory devices and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 12, 2024·3 cites·18 claims
- 0594US12080665B2Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 3, 2024·2 cites·20 claims
- 0694US11302627B1On-chip capacitors in three-dimensional semiconductor devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 12, 2022·3 cites·20 claims
- 0793US12176310B2Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Dec 24, 2024·2 cites·20 claims
- 0893US12082408B2Three-dimensional memory devices having first semiconductor structure bonded with second semiconductor structure each including peripheral circuit and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 3, 2024·2 cites·20 claims
- 0993US11450653B2Bonded three-dimensional memory devices having bonding layersYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 20, 2022·4 cites·20 claims
- 1089US12349341B2Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 1, 2025·1 cites·20 claims
- 1188US11233041B2Bonded three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 25, 2022·3 cites·20 claims
- 1288USD640246SShell of an electronic deviceFIH HONG KONG LTD·Filed 2010·Granted Jun 21, 2011·42 cites·1 claims
- 1388US2025378879A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1487US12033967B2Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 9, 2024·1 cites·20 claims
- 1587US11688695B2Semiconductor devices with shielding structuresYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jun 27, 2023·2 cites·20 claims
- 1687US11094714B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·20 claims
- 1786US12477749B2Three-dimensional memory devices having semiconductor assemblies bonded by bonding layer and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Nov 18, 2025·1 cites·20 claims
- 1886US12408338B2Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 2, 2025·1 cites·20 claims
- 1986US10726509B1Data mining data records to determine networks and boundariesCORELOGIC SOLUTIONS LLC·Filed 2016·Granted Jul 28, 2020·8 cites·26 claims
- 2085US12191269B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 7, 2025·1 cites·20 claims
- 2185US12069854B2Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 20, 2024·1 cites·20 claims
- 2285US11538780B2Structure and method for isolation of bit-line drivers for a three-dimensional NANDYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Dec 27, 2022·3 cites·8 claims
- 2384US12412628B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 2482US2025301651A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 2582US2025324604A1Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 2681US11069596B2Through silicon contact structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·14 claims
- 2779US8817460B2Bracket of electronic device, draw set assembly of electronic device, and computer caseYu shu-ming·Filed 2012·Granted Aug 26, 2014·11 cites·20 claims
- 2877US11437464B2Structure and method for forming capacitors for a three-dimensional NANDYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Sep 6, 2022·2 cites·13 claims
- 2977US11348936B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted May 31, 2022·2 cites·20 claims
- 3077US11031282B2Three-dimensional memory devices with deep isolation structuresYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jun 8, 2021·2 cites·20 claims
- 3177US2025336864A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 3277US2025336865A1Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 3377US2024213144A1On-chip capacitors in semiconductor devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 3476US12183698B2Structure and method for isolation of bit-line drivers for a three-dimensional NANDYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·19 claims
- 3576US11177343B2Three-dimensional memory devices with backside isolation structuresYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Nov 16, 2021·2 cites·21 claims
- 3676US2025070066A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 3775US2024387428A1Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 3875US2025070065A1Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 3974US11037945B2Bonded three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jun 15, 2021·1 cites·20 claims
- 4074US2024332232A1Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 4173US12255164B2Structure and method for isolation of bit-line drivers for a three-dimensional NANDYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 4273US2024381620A1Memory devices having vertical transistors and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 4372US12402309B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 26, 2025·0 cites·20 claims
- 4472US11232825B2Capacitor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jan 25, 2022·1 cites·18 claims
- 4572US2024014480A1Housing, battery, and electronic deviceBYD CO LTD·Filed 2023·Application pending·0 cites
- 4671US12420375B2Polishing pad and polishing methodIV TECH CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·25 claims
- 4771US12136449B2Capacitor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·17 claims
- 4871US11955422B2On-chip capacitors in semiconductor devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·15 claims
- 4971US11887646B2Capacitor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 5071US2025287583A1Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 160 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →