Inventor · disambiguated record
Yoichiro Kawamura
Also filed as: KAWAMURA YOICHIRO
26 granted patents·2 pending applications·450 citations·filing 1996–2012
97Inventor score
Top patents by PatentIndex Score
28 records- 0192US6342682B1Printed wiring board and manufacturing method thereofIBIDEN CO LTD·Filed 2000·Granted Jan 29, 2002·51 cites·9 claims
- 0291US6010768AMultilayer printed circuit board, method of producing multilayer printed circuit board and resin fillerIBIDEN CO LTD·Filed 1997·Granted Jan 4, 2000·74 cites·15 claims
- 0389US7714233B2Printed wiring boardIBIDEN CO LTD·Filed 2006·Granted May 11, 2010·15 cites·2 claims
- 0489US7371974B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2002·Granted May 13, 2008·43 cites·36 claims
- 0589US6251502B1Multilayer printed circuit board, method of producing multilayer printed circuit board and resin fillerIBIDEN CO LTD·Filed 1999·Granted Jun 26, 2001·58 cites·9 claims
- 0687US7475803B2Solder ball loading method and solder ball loading unit background of the inventionIBIDEN CO LTD·Filed 2006·Granted Jan 13, 2009·13 cites·9 claims
- 0783US7472473B2Solder ball loading apparatusIBIDEN CO LTD·Filed 2006·Granted Jan 6, 2009·9 cites·4 claims
- 0882US8003897B2Printed wiring boardIBIDEN CO LTD·Filed 2010·Granted Aug 23, 2011·4 cites·15 claims
- 0980US8017875B2Printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Sep 13, 2011·7 cites·10 claims
- 1080US6217988B1Multilayer printed circuit board, method of producing multilayer printed circuit board and resin fillerIBIDEN CO LTD·Filed 1999·Granted Apr 17, 2001·38 cites·12 claims
- 1179US6384344B1Circuit board for mounting electronic partsIBIDEN CO LTD·Filed 1999·Granted May 7, 2002·45 cites·18 claims
- 1276US8624132B2Printed wiring boardKAWAMURA YOICHIRO·Filed 2011·Granted Jan 7, 2014·2 cites·19 claims
- 1375US8222539B2Wiring board and method for manufacturing the sameKAWAMURA YOICHIRO·Filed 2009·Granted Jul 17, 2012·6 cites·20 claims
- 1475US8198546B2Printed wiring boardKAWAMURA YOICHIRO·Filed 2007·Granted Jun 12, 2012·8 cites·22 claims
- 1575US8022314B2Printed wiring boardIBIDEN CO LTD·Filed 2009·Granted Sep 20, 2011·4 cites·6 claims
- 1670US8030579B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Oct 4, 2011·3 cites·40 claims
- 1770US8001683B2Solder ball loading methodIBIDEN CO LTD·Filed 2008·Granted Aug 23, 2011·2 cites·5 claims
- 1869US9040843B2Multilayer printed wiring boardTOYODA YUKIHIKO·Filed 2012·Granted May 26, 2015·2 cites·22 claims
- 1968US6831234B1Multilayer printed circuit boardIBIDEN CO LTD·Filed 1997·Granted Dec 14, 2004·36 cites·20 claims
- 2066US8525041B2Multilayer wiring board and method for manufacturing the sameSHIMIZU KEISUKE·Filed 2009·Granted Sep 3, 2013·3 cites·16 claims
- 2163US7866529B2Solder ball loading method and solder ball loading unitIBIDEN CO LTD·Filed 2008·Granted Jan 11, 2011·2 cites·13 claims
- 2261US8832935B2Method of manufacturing a printed wiring boardKAWAMURA YOICHIRO·Filed 2010·Granted Sep 16, 2014·1 cites·20 claims
- 2359US6316738B1Printed wiring board and manufacturing method thereofIBIDEN CO LTD·Filed 1996·Granted Nov 13, 2001·17 cites·24 claims
- 2457USRE44251ECircuit board for mounting electronic partsASAI MOTOO·Filed 2004·Granted Jun 4, 2013·7 cites·37 claims
- 2548US8324512B2Multilayer printed wiring boardTOYODA YUKIHIKO·Filed 2011·Granted Dec 4, 2012·0 cites·35 claims
- 2648US2010212946A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2009·Application pending·0 cites
- 2745US2010224397A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2009·Application pending·0 cites
- 2842US7823762B2Manufacturing method and manufacturing apparatus of printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Nov 2, 2010·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →