Inventor · disambiguated record
Kiyoaki Iida
Also filed as: IIDA KIYOAKI
18 granted patents·127 citations·filing 2006–2017
92Inventor score
Top patents by PatentIndex Score
18 records- 0197US7989707B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 2, 2011·71 cites·12 claims
- 0294US8793868B2Chip embedded substrate and method of producing the sameYAMANO TAKAHARU·Filed 2011·Granted Aug 5, 2014·14 cites·6 claims
- 0385US8720519B2Electronic packaging apparatus and electronic packaging methodYAMAKAMI TAKATOYO·Filed 2011·Granted May 13, 2014·9 cites·7 claims
- 0476US7854367B2Apparatus and method for arranging magnetic solder ballsSHINKO ELECTRIC IND CO·Filed 2010·Granted Dec 21, 2010·3 cites·1 claims
- 0576US7784671B2Apparatus and method for arranging magnetic solder ballsSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 31, 2010·5 cites·1 claims
- 0676US7703662B2Conductive ball mounting apparatus and conductive ball mounting methodSHINKO ELECTRIC IND CO·Filed 2008·Granted Apr 27, 2010·5 cites·10 claims
- 0776US7597233B2Apparatus and method of mounting conductive ballSHINKO ELECTRIC IND CO·Filed 2008·Granted Oct 6, 2009·4 cites·2 claims
- 0872US8671561B2Substrate manufacturing methodIIDA KIYOAKI·Filed 2008·Granted Mar 18, 2014·7 cites·10 claims
- 0971US7854366B2Method of mounting conductive ball and conductive ball mounting apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted Dec 21, 2010·4 cites·6 claims
- 1068US8299628B2Conductive ball mounting apparatus having a movable conductive ball containerSAKAGUCHI HIDEAKI·Filed 2010·Granted Oct 30, 2012·2 cites·15 claims
- 1165US7866533B2Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted Jan 11, 2011·3 cites·7 claims
- 1258US10134680B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Nov 20, 2018·0 cites·16 claims
- 1358US9451702B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Sep 20, 2016·0 cites·19 claims
- 1457US9768122B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Sep 19, 2017·0 cites·19 claims
- 1554US7829451B2Conductive ball mounting method and apparatus having a movable solder ball containerSHINKO ELECTRIC IND CO·Filed 2008·Granted Nov 9, 2010·0 cites·7 claims
- 1652US7900807B2Conductive ball mounting apparatus and conductive ball mounting methodSHINKO ELECTRIC IND CO·Filed 2010·Granted Mar 8, 2011·0 cites·4 claims
- 1747US7866534B2Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing methodSHINKO ELECTRIC IND CO·Filed 2008·Granted Jan 11, 2011·0 cites·2 claims
- 1829US8141770B2Conductive ball mounting method and surplus ball removing apparatusSUNOHARA FUMIO·Filed 2008·Granted Mar 27, 2012·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →