Inventor · disambiguated record
Yoshihiko Toyoda
Also filed as: TOYODA YOSHIHIKO
17 granted patents·3 pending applications·423 citations·filing 1996–2013
95Inventor score
Files withMITSUBISHI ELECTRIC CORP19
Top patents by PatentIndex Score
20 records- 0192US6503376B2Electroplating apparatusMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jan 7, 2003·33 cites·16 claims
- 0288US6605861B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 12, 2003·43 cites·10 claims
- 0380US6107687ASemiconductor device having interconnection and adhesion layersMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 22, 2000·63 cites·1 claims
- 0478US6184124B1Method of making embedded wiring systemMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Feb 6, 2001·50 cites·9 claims
- 0576US7612378B2Semiconductor device with multiple impurity regions and image display apparatusMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Nov 3, 2009·10 cites·30 claims
- 0676US7176491B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Feb 13, 2007·6 cites·14 claims
- 0774US9988738B2Method for manufacturing SiC epitaxial waferMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jun 5, 2018·3 cites·20 claims
- 0874US7262433B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Aug 28, 2007·6 cites·10 claims
- 0974US5892286ASemiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Apr 6, 1999·45 cites·18 claims
- 1074US5793112AMultilevel embedded wiring systemMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 11, 1998·42 cites·18 claims
- 1171US7396707B2Fabrication method of a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Jul 8, 2008·4 cites·1 claims
- 1269US6039808ACVD apparatus for Cu formationMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Mar 21, 2000·32 cites·5 claims
- 1366US6215189B1Semiconductor device having interconnect layer and method of manufacturing thereforMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 10, 2001·32 cites·16 claims
- 1461US6417534B2Semiconductor device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jul 9, 2002·18 cites·12 claims
- 1560US6335570B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 1, 2002·26 cites·5 claims
- 1654US6667530B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 23, 2003·6 cites·10 claims
- 1738US2005253195A1Semiconductor device and image display deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 1837US2002140019A1Semiconductor device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1936US2002163086A1Semiconductor device and manufacturing method thereofFiled 2001·Application pending·0 cites
- 2034US6303495B2Method of forming thin copper film and semiconductor device with thin copper filmMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 16, 2001·4 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →