Inventor · disambiguated record
Gerald Feldewerth
Also filed as: FELDEWERTH GERALD · FELDEWERTH GERALD B
4 granted patents·2 pending applications·197 citations·filing 1994–2005
81Inventor score
Files withBARNAK JOHN P1FELDEWERTH GERALD B1INTEL CORP1JOHNSON MATTHEY ELECT INC1NOVELLUS SYSTEMS INC1
Top patents by PatentIndex Score
6 records- 0194US6821407B1Anode and anode chamber for copper electroplatingNOVELLUS SYSTEMS INC·Filed 2002·Granted Nov 23, 2004·97 cites·25 claims
- 0279US7064446B2Under bump metallization layer to enable use of high tin content solder bumpsINTEL CORP·Filed 2004·Granted Jun 20, 2006·29 cites·6 claims
- 0379US6030514AMethod of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly thereforSONY CORP·Filed 1997·Granted Feb 29, 2000·55 cites·29 claims
- 0454US5513834APreparation of high purity elementsJOHNSON MATTHEY ELECT INC·Filed 1994·Granted May 7, 1996·16 cites·2 claims
- 0540US2005250323A1Under bump metallization layer to enable use of high tin content solder bumpsBARNAK JOHN P·Filed 2005·Application pending·0 cites
- 0639US2006137969A1Method of manufacturing alloy sputtering targetsFELDEWERTH GERALD B·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →