Inventor · disambiguated record
Stephen St. Germain
Also filed as: ST GERMAIN STEPHEN · ST GERMAIN STEPHEN C
55 granted patents·4 pending applications·319 citations·filing 1997–2025
98Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC35SEMICONDUCTOR COMPONENTS IND21ARBUTHNOT ROGER M1CARNEY FRANCIS J1MOTOROLA INC1
Top patents by PatentIndex Score
59 records- 0198US11955412B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 9, 2024·8 cites·19 claims
- 0298US11948870B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 2, 2024·8 cites·19 claims
- 0398US11908840B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·8 cites·20 claims
- 0498US11894347B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 6, 2024·8 cites·20 claims
- 0598US11469163B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 11, 2022·8 cites·20 claims
- 0696US7319266B2Encapsulated electronic device structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Jan 15, 2008·36 cites·6 claims
- 0792US11462515B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 4, 2022·8 cites·12 claims
- 0891US2025336783A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0990US10090199B2Semiconductor device and method for supporting ultra-thin semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 2, 2018·4 cites·20 claims
- 1090US2025323222A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1189US6677672B2Structure and method of forming a multiple leadframe semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jan 13, 2004·48 cites·20 claims
- 1289US2025309199A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1387US12362266B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 1487US12347755B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 1586US12355009B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1686US12347812B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 1785US7495323B2Semiconductor package structure having multiple heat dissipation paths and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Feb 24, 2009·14 cites·18 claims
- 1884US6889429B2Method of making a lead-free integrated circuit packageSEMICONDUCTOR COMPONENTS IND·Filed 2001·Granted May 10, 2005·37 cites·16 claims
- 1983US6713317B2Semiconductor device and laminated leadframe packageSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Mar 30, 2004·35 cites·16 claims
- 2081US12417957B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 2179US11881398B2Semiconductor device and method for supporting ultra-thin semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jan 23, 2024·0 cites·18 claims
- 2275US11984388B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 2375US6833290B2Structure and method of forming a multiple leadframe semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Dec 21, 2004·18 cites·19 claims
- 2474US11842942B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 12, 2023·0 cites·21 claims
- 2572US11355341B2Semiconductor device and method for supporting ultra-thin semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 7, 2022·0 cites·17 claims
- 2670US6747341B2Integrated circuit and laminated leadframe packageSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jun 8, 2004·17 cites·18 claims
- 2769US11710686B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 2868US7202105B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·12 cites·20 claims
- 2967US11282764B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 3067US7298034B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Nov 20, 2007·12 cites·6 claims
- 3165US7875964B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Jan 25, 2011·2 cites·9 claims
- 3263US10672607B2Semiconductor device and method for supporting ultra-thin semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jun 2, 2020·0 cites·18 claims
- 3363US2019326202A1Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Application pending·0 cites
- 3462US7935575B2Method of forming a semiconductor package and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted May 3, 2011·2 cites·10 claims
- 3562US7397120B2Semiconductor package structure for vertical mount and methodSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Jul 8, 2008·2 cites·18 claims
- 3661US7476959B2Encapsulated electronic deviceSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Jan 13, 2009·1 cites·5 claims
- 3761US7180170B2Lead-free integrated circuit package structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Feb 20, 2007·2 cites·19 claims
- 3859US10490488B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Nov 26, 2019·0 cites·20 claims
- 3958US11217515B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 4058US10325835B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 4157US11521928B2Reducing stress cracks in substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 6, 2022·0 cites·20 claims
- 4257US10522448B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Dec 31, 2019·0 cites·18 claims
- 4357US9576883B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Feb 21, 2017·0 cites·20 claims
- 4457US9379193B2Semiconductor package for a lateral device and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jun 28, 2016·0 cites·5 claims
- 4557US7135761B2Robust power semiconductor packageSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Nov 14, 2006·7 cites·26 claims
- 4656US9558968B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Jan 31, 2017·0 cites·16 claims
- 4755US9397028B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted Jul 19, 2016·0 cites·20 claims
- 4854US9870986B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jan 16, 2018·0 cites·17 claims
- 4953US9773895B2Half-bridge HEMT circuit and an electronic package including the circuitSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Sep 26, 2017·0 cites·19 claims
- 5053US6103548ASemiconductor device and method of manufactureMOTOROLA INC·Filed 1997·Granted Aug 15, 2000·19 cites·9 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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