Inventor · disambiguated record
Debabrata Gupta
Also filed as: GUPTA DEBABRATA
14 granted patents·524 citations·filing 1983–2014
94Inventor score
Top patents by PatentIndex Score
14 records- 0195US6775150B1Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufactureINTEL CORP·Filed 2000·Granted Aug 10, 2004·70 cites·33 claims
- 0293US8853558B2Interconnect structureGUPTA DEBABRATA·Filed 2010·Granted Oct 7, 2014·35 cites·27 claims
- 0392US5198963AMultiple integrated circuit module which simplifies handling and testingMOTOROLA INC·Filed 1991·Granted Mar 30, 1993·176 cites·15 claims
- 0490US5341979AMethod of bonding a semiconductor substrate to a support substrate and structure thereforeMOTOROLA INC·Filed 1993·Granted Aug 30, 1994·134 cites·15 claims
- 0585US7120031B2Data processing system comprising ceramic/organic hybrid substrate with embedded capacitorsINTEL CORP·Filed 2004·Granted Oct 10, 2006·26 cites·3 claims
- 0684US4564390ADecarburizing a metal or metal alloy meltOLIN CORP·Filed 1984·Granted Jan 14, 1986·13 cites·21 claims
- 0783US7535728B2Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitorsINTEL CORP·Filed 2006·Granted May 19, 2009·8 cites·15 claims
- 0864US7413936B2Method of forming copper layersINTEL CORP·Filed 2005·Granted Aug 19, 2008·3 cites·4 claims
- 0962US5451274AReflow of multi-layer metal bumpsMOTOROLA INC·Filed 1994·Granted Sep 19, 1995·30 cites·8 claims
- 1058US5567648AProcess for providing interconnect bumps on a bonding pad by application of a sheet of conductive discsMOTOROLA INC·Filed 1995·Granted Oct 22, 1996·20 cites·19 claims
- 1153US9496236B2Interconnect structureTESSERA INC·Filed 2014·Granted Nov 15, 2016·0 cites·17 claims
- 1250US4472195AProcess for decarburizing alloy meltsOLIN CORP·Filed 1983·Granted Sep 18, 1984·4 cites·19 claims
- 1348US7005727B2Low cost programmable CPU package/substrateINTEL CORP·Filed 2002·Granted Feb 28, 2006·4 cites·15 claims
- 1432US4773469AComposite mold for continuous thin strip castingOLIN CORP·Filed 1988·Granted Sep 27, 1988·1 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →